In some examples a method comprises forming an insulating member over a circuit on a device side of a semiconductor die, removing a portion of the insulating member to produce a cavity, and forming a seed layer on the insulating member and within the cavity. In addition, the method includes forming a conductive member on the seed layer in the cavity, wherein the conductive member comprises a plurality of layers of different metal materials. Further, the method includes removing the seed layer from atop the insulating member, outside the cavity, after forming the conductive member in the cavity such that a remaining portion of the seed layer is positioned between the conductive member and the insulating member.

The third side surface includes inclined surfaces inclined in a direction in which a center in an up-down direction of the third side surface is convex. The mold resin further includes a residual section provided in the center of the third side surface and a dowel section provided between the inclined surface and the residual section. The dowel section projects further in a lateral direction than the inclined surface. The residual section further projects in the lateral direction than the dowel section and has a fracture surface perpendicular to the up-down direction.

A semiconductor device according to the present disclosure includes: a lead frame having a plurality of die pad portions electrically independent from each other; a power semiconductor element provided on each of the die pad portions; a wire electrically connecting the power semiconductor element and the lead frame; an epoxy-based resin provided on at least a part of the lead frame; and a sealing resin covering at least each of the die pad portions, the power semiconductor element, the wire, and the epoxy-based resin.

A semiconductor device includes: a semiconductor element; a mold member covering the semiconductor element; and a first terminal and a second terminal electrically connected to the semiconductor element, protruding from one side of the mold member, and alternating along the one side. The first terminal includes a first bend, and the second terminal includes: a second bend located further from the one side of the mold member than the first bend, and having the same width as the first bend in plan view.

A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

A semiconductor module, including a semiconductor chip, a sealed main body portion sealing the semiconductor chip and having a pair of attachment holes penetrating therethrough, a heat dissipation plate in contact with the sealed main body portion. The heat dissipation plate is positioned between the attachment holes in a plan view of the semiconductor module. The semiconductor module further includes a pair of rear surface supporting portions and/or a pair of front surface supporting portions protruding respectively from rear and front surfaces of the sealed main body portion. In the plan view, the heat dissipation plate is formed between the pair of attachment holes, which are in turn between the pair of rear surface supporting portions. The pair of front surface supporting portions are formed substantially between the pair of attachment holes in the plan view.

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.

A semiconductor package includes a die pad, a semiconductor die mounted on the die pad and comprising a first terminal facing away from the die pad and a second terminal facing and electrically connected to the die pad, an interconnect clip electrically connected to the first terminal, an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interconnect clip, and a first opening in the encapsulant body that exposes a surface of the interconnect clip, the encapsulant body comprises a lower surface, an upper surface opposite from the lower surface, and a first outer edge side extending between the lower surface and the upper surface, and the first opening is laterally offset from the first outer edge side.

A semiconductor device includes: a semiconductor element, a first lead frame, a second lead frame, and a thermally conductive member; and a sealing member sealing them. The first lead frame includes: a first portion exposed from a first side surface of the sealing member; and a second portion located closer to a lower surface of the sealing member than the first portion in a second direction crossing the lower surface. The semiconductor device further includes an intermediate frame which is located between the second portion and the fifth portion at least in the second direction. A distance, in the first direction, between the second portion and the intermediate frame is shorter than a distance, in the second direction, between an upper surface of the first portion and the upper surface of the second portion.