A HgZnTe detector on a silicon substrate provides significant advantages over conventionally used HgCdTe detectors on silicon substrates, as HgZnTe is a harder material than HgCdTe, and has less lattice mismatch with silicon than HgCdTe. HgZnTe also has a higher dislocation energy than HgCdTe, as well as a higher thermal stability than HgCdTe, making it more resistant to dislocation.

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Arsenide (InAs)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

Methods, systems, and apparatus that filters noise within a signal collected by a detector assembly. The detector assembly includes a first semiconductor layer of a first type configured to receive a photon. The detector assembly includes a second semiconductor layer of a second type. The second semiconductor layer is formed above the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are configured to collect a signal. The detector assembly includes an interface layer including an insulator portion for filtering noise. The interface layer is formed on the second semiconductor layer. The detector assembly includes a metal contact layer formed on the interface layer. The interface layer is configured to capacitively couple the first semiconductor layer and second semiconductor layer with the metal contact layer.

A light sensor includes an N-type semiconductor. The light sensor further includes a P-type semiconductor stacked on at least a portion of the N-type semiconductor, partially defining a trench extending into the P-type semiconductor, and having a trench portion aligned with the trench and extending farther into the N-type semiconductor than other portions of the P-type semiconductor. The light sensor also includes a passivation layer stacked on and contacting the P-type semiconductor and partially defining the trench that extends through the passivation layer and into the P-type semiconductor. The light sensor further includes an electrical contact stacked on the passivation layer, positioned within the trench, and extending through the passivation layer into the P-type semiconductor such that photons received by the N-type semiconductor generate photocurrent resulting in a voltage at the electrical contact.

The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy.

An array of mesa photodiodes, including a useful layer of Cd.sub.xHg.sub.1-xTe wherein pads are formed. The array includes a first doped zone having a first N or P doping; and second doped zones having a second P or N doping of a different type from that of the first doping, and each extending on an upper region of a pad. The first doped zone includes at least one first region having a first doping density, located at least under each of the pads; and at least one second region, located between two neighboring pads, and having a second doping density higher than the first doping density, each second region being separated from the closest second doped zone by at least one portion of the first region.

The detection device comprises a cold finger which performs thermal connection between a detector fitted on a cooling plate and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the hafnium-based amorphous metal alloy. Advantageously, the whole of the cold finger is made from the hafnium-based amorphous metal alloy.

A photodetection device including a diode array and a method for production thereof. In the device, each diode of the array includes an absorption region having a first bandgap energy and a collection region having a first doping type, and adjacent diodes in a network are separated by a trench including sides and a bottom. The bottom and sides of the trench form a stabilization layer having a second doping type, opposite the first doping type, and a bandgap energy greater than the first bandgap energy of the absorption regions.

The invention relates to a photodiode type structure (comprising: a support (100) including at least one semiconductor layer, the semiconductor layer (120) including of a first semiconductor zone (10) of a first type of conductivity and a mesa (130) in contact with the semiconductor layer (120). The mesa (130) includes of a second semiconductor zone (20), known as absorption zone, said second semiconductor zone (20) being of a second type of conductivity. The second semiconductor zone has a concentration of majority carriers such that the second semiconductor zone (30) is depleted in the absence of polarization of the structure (1). The structure (1) further comprises a third semiconductor zone (30) of the second type of conductivity made of a third material transparent in the absorbed wavelength range. The third semiconductor zone (30) is interposed between the first and the second semiconductor zones (10, 20) while being at least partially arranged in the semiconductor layer (120). The invention also relates to a component and a method for manufacturing such a structure (1).

A photodetection device and a method for manufacturing the device, the device including a substrate and an array of diodes, the substrate including an absorption layer including a first type of doping, and each diode including, in the absorption layer, a collection region including a second type of doping opposite to the first type. The device further includes, under the surface of the substrate, a conductive mesh including at least one conductive channel inserted between the collection regions of two adjacent diodes, the at least one conductive channel including the first type of doping and a higher doping density than the absorption layer. The doping density of the at least one conductive channel is the result of a diffusion of metal in the absorption layer from a metal mesh provided on the surface of the substrate.