The disclosure discloses a photoelectric detector and a photoelectric detection device, the photoelectric detector includes: a photosensitive active layer (100) including a first surface (1) and a second surface (2) opposite to each other; a first electrode (200) and a second electrode (300) located on the first surface (1) of the photosensitive active layer (100), and arranged spaced apart from each other; and a third electrode (400) located on the second surface (2) of the photosensitive active layer (100); where the first electrode (200) and the second electrode (300) respectively contact directly with the first surface (1) of the photosensitive active layer (100), and the third electrode (400) contacts directly with the second surface (2) of the photosensitive active layer (100). The photoelectric detector can improve the contrast between light current and dark current.

A (GaMe).sub.2O.sub.3 ternary alloy material, its preparation method and application in a solar-blind ultraviolet photodetector are provided. The (GaMe).sub.2O.sub.3 ternary alloy material of the present invention is formed by solid solution of Ga.sub.2O.sub.3 and Me.sub.2O.sub.3 in a molar ratio of 99:1 to 50:50, wherein the Me is any one of Lu, Sc, or Y. The (GaMe).sub.2O.sub.3 ternary alloy material of the present invention can be used to prepare the active layer of a solar-blind ultraviolet photodetector. In the present invention, the band gap of Me.sub.2O.sub.3 is higher than that of Ga.sub.2O.sub.3, and Ga.sup.3+ ions in Ga.sub.2O.sub.3 are partially replaced by Me.sup.3+ ions to obtain a higher band gap (GaMe).sub.2O.sub.3 ternary alloy material to reduce the dark current of the device and promote the blue shift of the cut-off wavelength to within 280 nm.

The method for manufacturing the heterojunction circuit according to one embodiment of the present disclosure comprises depositing a first electrode on at least a part of a waveguide, moving a semiconductor comprising a second electrode at a lower end thereof onto the first electrode, and depositing a third electrode on an upper end of the semiconductor, wherein the waveguide and the semiconductor comprise different materials. Additionally, the moving step further comprises generating microbubbles by supplying heat to at least a part of the semiconductor, moving the semiconductor on the first electrode by moving the generated microbubbles, and removing the microbubbles by positioning the semiconductor on the first electrode.

Radiation detectors based on high electron mobility transistors (HEMTs) are provided. Methods for detecting ultraviolet radiation using the HEMTs are also provided. The transistors are constructed from an intrinsic high bandgap semiconductor material with a built-in polarization field sandwiched between graphene and a two-dimensional electron gas (2DEG).

A photodetector is provided with a metal-semiconductor junction for measuring infrared radiation. In another embodiment, the photodetector includes structures to achieve localized surface plasmon resonance at the metal-semiconductor junction stimulated by incident light. The photodetector hence has prompted response and broadband spectra region for photon detection. The photodetector can be used for detecting varied powers of incident light with wavelength from visible to mid-infrared region (300 nm20 m).

The present invention teaches a structure of a photodetector and the method of making thereof. A photodetector inaccordance of the present invention is easy to fabricate, can be fabricated through low temperature processes, has high responsivity, high switching speed and high active area to device area ratio, is able to operate under photovotaic mode or reverse bias conditions.

An exemplary photodetector can be provided, which can include, for example, a metal contact, a metal stripe coupled to the metal contact. The semiconductor(s) can surround the metal stripe on at least three sides of the metal stripe. The semiconductor(s) can surround the metal stripe on at least four sides. The semiconductor can surround the metal stripe on at least five sides. A silicon dioxide layer can be coupled to the at least one semiconductor. A graphene layer located can be between the metal stripe and the semiconductor(s).

A detection panel and a manufacturing method of the same are provided. The detection panel includes: a photosensitive element configured to sense a first light beam incident to the photosensitive element to generate a photosensitive signal; a drive circuit configured to be coupled to the photosensitive element to acquire the photosensitive signal from the photosensitive element, the drive circuit including a switch element; and a reflective grating which is on a side of the drive circuit where the first light beam is incident, and is configured to reflect at least a portion of the first light beam incident toward the switch element.

An exemplary photodetector can be provided, which can include, for example, a metal contact, a metal stripe coupled to the metal contact, and a photon absorbing material(s) surrounding the metal stripe on at least four sides of the metal stripe. The photon absorbing material(s) can be germanium. The photon absorbing material(s) can be configured to absorb photons in a wavelength range of about 1.1 m to about 1.7 m.

A broad-spectral-bandwidth photodetector designed for use with all types of optical fibers used in different avionics networks and sensors and a process for fabricating such photodetectors. A Schottky barrier photodetector is provided that includes germanium, which has a broad spectral response to light in the ultraviolet to near-infrared range (220 to 1600 nm). The provision of a photodetector having a broad spectral response avoids the use of multiple different types of photodetectors and receivers in an avionics platform with different optical fiber networks and sensors.