In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

The disclosure relates to systems, methods and devices providing a modular building block towards a fabrication process for embedding a multiplicity of active and passive components in a three-dimensional structure by either automated or otherwise robotic pick and place systems, or part of the actual build of the structure, hence accelerating the miniaturization of fully functional AMEs with smaller form factor. Specifically, the disclosure is directed to the use of additive manufacturing technologies and systems, methods and compositions for fabricating multilayer AMEs having integrated active integrated circuits, RF antennas, signal indicators such as LED, and passive components such as coils, capacitor, and resistors, embedded within the AMEs.

Packaged device having a carrying base; an accommodation cavity in the carrying base; a semiconductor die in the accommodation cavity, the semiconductor die having die pads; a protective layer, covering the semiconductor die and the carrying base; first vias in the protective layer, at the die pads; and connection terminals of conductive material. The connection terminals have first connection portions in the first vias, in electrical contact with the die pads, and second connection portions, extending on the protective layer, along a side surface of the packaged device.

A semiconductor package may include a package substrate, a support structure on the package substrate and having a cavity therein, and at least one first semiconductor chip on the package substrate in the cavity. The support structure may have a first inner sidewall facing the cavity, a first top surface, and a first inclined surface connecting the first inner sidewall and the first top surface. The first inclined surface may be inclined with respect to a top surface of the at least one first semiconductor chip.

Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.

An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.

A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

An electronic element mounting substrate according to the present disclosure includes a base body having a recessed portion including a mounting region on which an electronic element is mounted and a cutout section located on an outer periphery of the base body in a plane perspective, and a channel having an inner end portion located on an inner wall of the base body and an outer end portion located on the outer periphery of the base body. The inner end portion of the channel is open to the recessed portion, and the outer end portion of the channel is continuous with the cutout section.