The present disclosure provides a light-emitting diode, a method for manufacturing the same, a backlight source and a display device. The light-emitting diode includes a support having a bottom wall, a light-emitting chip on the support, and a die bonding structure. A through hole is provided in the bottom wall. At least a portion of the die bonding structure is located in the through hole. The light-emitting chip is attached to the bottom wall through the die bonding structure.

A semiconductor device according to the embodiment may include a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer; a first bonding pad disposed on the light emitting structure and electrically connected to the first conductivity type semiconductor layer; a second bonding pad disposed on the light emitting structure and spaced apart from the first bonding pad, and electrically connected to the second conductivity type semiconductor layer; and a reflective layer disposed on the light emitting structure and disposed between the first bonding pad and the second bonding pad. According to the semiconductor device of the embodiment, each of the first bonding pad and the second bonding pad includes a porous metal layer having a plurality of pores and a bonding alloy layer disposed on the porous metal layer.

Microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that, provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.

A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.

A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.

A package module includes a core structure including a frame having a penetrating portion, an electronic component disposed in the penetrating portion, and an insulating material covering at least a portion of each of the frame and the electronic component and filling at least a portion of the penetrating portion. The core structure further has a recessed portion in which a stopper layer is disposed on a bottom surface of the recessed portion. A semiconductor chip has a connection pad and is disposed in the recessed portion such that an inactive surface faces the stopper layer. An encapsulant covers at least a portion of each of the core structure and the semiconductor chip, and fills at least a portion of the recessed portion. An interconnect structure is disposed on the core structure and an active surface of the semiconductor chip, and includes a redistribution layer.

A system-in-package apparatus includes a contoured heat sink that provides a first recess and a subsequent recess. The system-in-package apparatus includes a flexible printed wiring board that is wrapped onto the contoured heat sink after a manner to enclose the first semiconductive device into the first recess and a semiconductive device in the subsequent recess.

A display device comprising: a first substrate; a plurality of pixels provided to the first substrate; a light emitting element provided to each of the pixels; a phosphor layer covering at least an upper surface of the light emitting element; a first reflective layer facing a side surface of the light emitting element; and a second reflective layer provided to a side surface of the phosphor layer, separated from the first reflective layer in a normal direction of the first substrate, and disposed farther away from the first substrate than the first reflective layer.

A fan-out semiconductor package includes a frame including a plurality of wiring layers electrically connected to each other and having a recess portion having a bottom surface on which a stopper layer is disposed, a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, the inactive surface being disposed in the recess portion to face the stopper layer, an encapsulant covering at least a portion of the frame and at least a portion of the semiconductor chip, the encapsulant being disposed in at least a portion of the recess portion, and a connection structure disposed on the frame and the active surface and including a redistribution layer electrically connected to the plurality of wiring layers and the connection pad. A thickness of the stopper layer is greater than a thickness of each of the plurality of wiring layers.

In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.