A package for a tunable filter is disclosed. In an embodiment, the tunable filter includes a substrate having a first interconnection plane and a semiconductor device assembled on the substrate in a first component plane, the semiconductor device electrically connected to the first interconnection plane and containing tunable passive components. The filter further includes a control unit arranged in the first component plane, a dielectric layer arranged above the first component plane, a second component plane arranged on the dielectric layer and discrete passive devices arranged in the second component plane and interconnected with the semiconductor device, wherein the tunable passive components are tunable by the control unit.

A method of operating a radio frequency (RF) module includes filtering, by a substrate integrated waveguide (SIW) band-pass filter, an RF signal propagating between an antenna and an interface structure. The antenna is disposed at a first side of a substrate. The interface structure is disposed at a second side of the substrate opposite the first side The SIW band-pass filter is disposed within the substrate between the antenna and the interface structure. The method of operating the RF module further includes transferring, by the interface structure, the RF signal between the SIW band-pass filter and an RF front end circuit.

The present invention provides filter assemblies, tuning elements and a method of tuning a filter. A filter assembly includes a housing having a top cover, a bottom cover and at least one sidewall, the top cover, the bottom cover and the at least one sidewall defining an internal cavity, the housing configured to receive first through third radio frequency (RF) transmission lines; a top metal sheet mounted within the internal cavity that has a plurality of openings that form a first hole pattern; and a bottom metal sheet mounted within the internal cavity that has a plurality of openings that form a second hole pattern. The top and bottom metal sheets are vertically spaced-apart from each other in a vertically stacked relationship within the internal cavity. The top metal sheet and the bottom metal sheet each include at least one resonator.

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

An LC filter includes a laminate including insulating layers laminated in a lamination direction, an inductor having a spiral or helical shape around an axis parallel or substantially parallel to the lamination direction, and a capacitor in which capacitor conductors face each other. The inductor and the capacitor do not overlap as viewed from the lamination direction and all directions orthogonal or substantially orthogonal to the lamination direction.

A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.

A high-frequency filter includes a first terminal, a second terminal, a third terminal, a first inductor, a second inductor, a third inductor, and a fourth inductor. The first inductor and the second inductor are connected in series to each other between the first terminal and the second terminal. The third inductor and the fourth inductor are connected in parallel to each other between the third terminal and a node of the first inductor and the second inductor. The connection between the first inductor and the second inductor is an additive polarity connection. The connection between the third inductor and the fourth inductor is an additive polarity connection.

A filter includes: a first ground conductor layer and a second ground conductor layer arranged to be spaced from each other, a resonator conductor layer arranged between the first ground conductor layer and the second ground conductor layer and constituting a part of a resonator, a through hole connecting the first ground conductor layers and the resonator conductor layer and constituting a different part of the resonator, and a body. The resonator conductor layer is not directly connected to the second ground conductor layer.

A microstrip filter is provided in the present disclosure. The microstrip filter includes a substrate having a first surface and a second surface opposite to each other, a first spiral metal line formed on the first surface of the substrate, and a second spiral metal line formed on the second surface of the substrate. At least part of the first spiral metal line overlaps and is coupled to the second spiral metal line for forming a filter capacitor. The present disclosure also provides a microphone device using the microstrip filter.

An electronic component includes first through sixth LC parallel resonators and seventh through ninth capacitors. The first through sixth LC parallel resonators are arranged in this order in a first direction perpendicular or substantially perpendicular to a stacking direction of a multilayer body of the electronic component, and define a band pass filter. The seventh capacitor is connected between the first and sixth LC parallel resonators. The eighth capacitor is connected between the first and third LC parallel resonators. The ninth capacitor is connected between the fourth and sixth LC parallel resonators.