A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).

A high-frequency module including a transmission line for a high-frequency signal and a waveguide conversion structure, capable of reducing the size thereof, and a method for manufacturing such a high-frequency module are provided. A high-frequency module includes a core material in which a first dielectric layer is provided between a first conductive layer and a second conductive layer, a laminated filter in which a plurality of core materials and dielectric layers are alternately laminated, and a through hole pierces therethrough from a lowermost conductive layer provided so as to be in contact with the lowermost dielectric layer to the uppermost first conductive layer, a first surface dielectric layer provided above the laminated filter, and a first surface conductive layer provided above the first surface dielectric layer, the first surface conductive layer including a transmission line for a high-frequency signal and a ground GND.

A first end of a linear conductor of a resonator is connected to a ground conductor on a first surface of a dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. A first end of a linear conductor of a resonator is connected to a ground conductor on a second surface of the dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. An input-output line is connected to the ground conductor on the second surface of the dielectric substrate through a via. An input-output line is opposed to the second ends of the linear conductor of the two resonators.

A coaxial line is provided which includes: a first columnar conductor disposed inside a multilayer substrate such that one end thereof is coupled to a first stripline and that the other end thereof is coupled to a second stripline; and one or more second columnar conductors penetrating the multilayer substrate such that one end thereof is coupled to a ground layer and that the other end thereof is coupled to a ground layer, the first columnar conductor acting as an inner conductor, and the second columnar conductors acting as outer conductors. Each of the first and second striplines is coupled to an open stub acting as resonators and a matching conductor acting as capacitance matching elements.

The present disclosure relates to an interposer (120), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer (120) includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (123), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub (124) is formed.

Provided is a filter capable of suppressing variation in characteristics. A filter has: a plurality of resonators each having a via electrode and a first strip line that is opposed to a first shielding conductor and connected to one end of the via electrode; a first coupling capacitive electrode that has a first comb-shaped electrode including a plurality of first electrodes and that is provided to the first resonator; and a second coupling capacitive electrode that is provided to the second resonator, that has a second comb-shaped electrode including a plurality of second electrodes, and that is formed on the same layer as that of the first coupling capacitive electrode, wherein the first and second electrodes are arranged so as to be adjacent to each other.

A filter device includes a ground conductor layer, at least one through hole electrically connected to the ground conductor layer, a first resonator conductor layer and a second resonator conductor layer arranged to sandwich the at least one through hole, and a stack. The first resonator conductor layer extends in a first direction becoming away from the at least one through hole, i.e., the −X direction. The second resonator conductor layer extends in a second direction becoming away from the at least one through hole, i.e., the X direction.

The present invention provides a compact filter with excellent characteristics. This filter has a plurality of resonators, each of which having: via electrode parts formed inside a dielectric substrate; and a first strip line that faces a first shielding conductor of a plurality of shielding conductors formed so as to surround the via electrode parts, the first strip line being connected to one end of the via electrode parts. The positions of the via electrode parts of the first resonator of the plurality of resonators, and the positions of the via electrode parts of the second resonator, which is adjacent to the first resonator, are mutually offset in a first direction (X), which is the longitudinal direction of the first strip line.

A distributed constant filter includes a resonator that is not grounded and a first ground electrode. The first ground electrode faces the resonator in a first direction (Z). The resonator is a distributed constant line resonator. The resonator includes a plurality of distributed constant lines and a via conductor. The plurality of distributed constant lines are arranged in layers in the first direction (Z). The via conductor extends in the first direction (Z). Each of the plurality of distributed constant lines is connected to the via conductor only at one end portion of both end portions of the distributed constant line.

Apparatus comprising a first layer of electrically conductive material, a second layer of electrically conductive material, and at least one dielectric layer, which comprises a solid dielectric material, arranged between said first layer and said second layer, wherein at least one distributed resonator structure comprising a plurality of resonator posts is arranged in said at least one dielectric layer.