Patent classifications
H01P1/20345
Band-pass filter and control method thereof
There is provided a band-pass filter capable of easily changing a bandwidth of a pass band. A band-pass filter (1B) of the present disclosure includes: a housing (11), a plurality of resonant plates (12) stored in the housing (11), a first coupling conductor (15) connecting two adjacent resonant plates (12) of the plurality of resonant plates (12), and a second coupling conductor (16) arranged at a position affecting a coupling coefficient between the two adjacent resonant plates (12), wherein a distance from the resonant plate (12) to the second coupling conductor (16) is changeable.
Band-pass filter
A band-pass filter includes five resonators. The five resonators are configured so that capacitive coupling is established between every two of the resonators adjacent to each other in circuit configuration. The first stage resonator and the fifth stage resonator are magnetically coupled to each other. The second stage resonator and the fourth stage resonator are capacitively coupled to each other. Each of the five resonators includes a resonator conductor portion. The respective resonator conductor portions of the first and fifth stage resonators are physically adjacent to each other. The respective resonator conductor portions of the second and fourth stage resonators are physically adjacent to each other. The respective resonator conductor portions of the first and second stage resonators are physically adjacent to each other. The respective resonator conductor portions of the fourth and fifth stage resonators are physically adjacent to each other.
HIGH FREQUENCY FILTER
A coaxial line is provided which includes: a first columnar conductor disposed inside a multilayer substrate such that one end thereof is coupled to a first stripline and that the other end thereof is coupled to a second stripline; and one or more second columnar conductors penetrating the multilayer substrate such that one end thereof is coupled to a ground layer and that the other end thereof is coupled to a ground layer, the first columnar conductor acting as an inner conductor, and the second columnar conductors acting as outer conductors. Each of the first and second striplines is coupled to an open stub acting as resonators and a matching conductor acting as capacitance matching elements.
LOW TEMPERATURE CO-FIRED CERAMIC BAND-PASS FILTER
The present application provides an LTCC band-pass filter, including a shell and a filtering assembly. The shell includes a top wall and a bottom wall. The filtering assembly includes a first layer, two second layers respectively overlapped on two opposite sides of the first layer, two third layers respectively overlapped on two sides of the two second layers far away from the first layer, and a fourth layer sandwiched between one of the second layers and the third layers. The first layer is served as an inductance L. The second layer is served as a grounding capacitor C. The second layer and the first layer are coupled together to form an LC resonance unit. The third layer is connected with the ground, and is served as a shielding layer of the LTCC band-pass filter.
LOW TEMPERATURE CO-FIRED CERAMIC FILTER
The present invention provides an LTCC filter, including a shell and a filtering assembly. The filtering assembly includes a first layer, two second layers, and two third layers. The first layer includes a first layer top end and a first layer bottom end. The first layer top end is grounded. The first layer bottom layer forms an open circuit state, and the first layer serves as an inductance L. The second layer includes a second layer top end and a second layer bottom end. The second layer top end forms the open circuit state. The second layer bottom end is grounded. The second layer serves as a grounding capacitor C, and the second layer and the first layer are coupled together to form an LC resonance unit. The third layer is grounded, and serves as a shielding layer of the filter.
Antenna assistant device and electronic device including the same
An electronic device is provided. The electronic device includes a housing, a communication circuit disposed on one side of the housing, a multi-layered printed circuit board (PCB) disposed on one side of the housing and electrically connected to the communication circuit and an antenna radiator disposed on one side of the housing or defining at least a portion of an outer surface of the housing, and is electrically connected to the communication circuit and the multi-layered printed circuit board, wherein the multi-layered printed circuit board comprises a first conductive pattern disposed in at least one of a plurality of layers thereof to form a capacitance, a second conductive pattern disposed in at least another one of the plurality of layers thereof to form an inductance and a conductive plate disposed between the at least one and the at least other one of the plurality of layers and is electrically isolated from the first conductive pattern and the second conductive pattern.
Composite electronic component
A composite electronic component includes a multilayer stack, a filter, and an antenna. The filter is located within the multilayer stack and interposed between a first ground conductor layer and a second ground conductor layer. The antenna includes a radiation element. The radiation element is located on a side of the second ground conductor layer opposite from the first ground conductor layer. When viewed in a direction parallel to the stacking direction of the multilayer stack, the radiation element entirely lies inside the perimeter of the second ground conductor layer. The multilayer stack includes a plurality of connection conductor sections arranged around the filter and connecting the first ground conductor layer and the second ground conductor layer.
Multilayer electronic component
A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
BAND-PASS FILTER
A band-pass filter includes first to sixth stage resonators. Each resonator includes a resonator conductor portion formed of a conductor line. The resonator conductor portion has a first end and a second end which are opposite ends of the conductor line. The resonator conductor portion of each of the first and sixth stage resonators includes a narrow portion, a first wide portion located between the narrow portion and the first end, and a second wide portion located between the narrow portion and the second end. Each of the first and sixth stage resonators is lower in unloaded Q than the other resonators.
FILTER ASSEMBLIES, TUNING ELEMENTS AND METHOD OF TUNING A FILTER
The present invention provides filter assemblies, tuning elements and a method of tuning a filter. A filter assembly includes a housing having a top cover, a bottom cover and at least one sidewall, the top cover, the bottom cover and the at least one sidewall defining an internal cavity, the housing configured to receive first through third radio frequency (RF) transmission lines; a top metal sheet mounted within the internal cavity that has a plurality of openings that form a first hole pattern; and a bottom metal sheet mounted within the internal cavity that has a plurality of openings that form a second hole pattern. The top and bottom metal sheets are vertically spaced-apart from each other in a vertically stacked relationship within the internal cavity. The top metal sheet and the bottom metal sheet each include at least one resonator.