An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

A method and apparatus for tuning crosstalk and return loss are provided. In the method and apparatus, a filter tunes return loss caused by a first external terminal and a second external terminal to compensate for a capacitive load induced by sizes of and a proximity between the first and second external terminals. The filter decouples the tuning of the return loss from tuning a magnitude and a phase of a crosstalk between a first transmission line network and a second transmission line network such that the return loss is tuned with minimal impact on the crosstalk.

A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

The invention discloses a filter device. The filter device comprises a substrate, at least one transmission conductor, and a reference conductor having a slotted structure. The substrate is provided at a first surface thereof with the transmission conductor, and provided at a second surface thereof with the reference conductor. The slotted structure comprises a frame portion, a slotted portion, and a hollow portion. The slotted portion surrounds the frame portion, and the hollow portion is formed in the frame portion. At least one impedance unit is configured on the frame portion. The equivalent filter circuit of the filter device is formed between the transmission conductor, the slotted structure, the reference conductor, and the impedance unit. Thereby, the equivalent filter circuit absorbs at least one noise at at least one specific frequency by the impedance unit to avoid the noise reflected to affect the transmission quality of signal.

A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.

A filter configuration including a substrate, a primary microstrip line and a first defected ground structure is disclosed. The substrate has a first face and a second face. The second face is a ground face. The primary microstrip line is arranged on the first face and extends in a first direction. The first defected ground structure is arranged on the second face. The first defected ground structure includes a first section, a first circular section, a second section, a second circular section and a third section that are connected to each other in sequence in a second direction perpendicular to the first direction. The second section is covered by the primary microstrip line in a vertical direction perpendicular to the first and second faces. The primary microstrip line has a width equal to a minimum length of the second section. As such, the filtering effect can be improved.

A step impedance resonator filter including a first resonator and a second resonator is disclosed. The first resonator includes a first coupled line and a first tapped line connected to the first coupled line. The second resonator includes a second coupled line and a second tapped line connected to the second coupled line. The second coupled line is coupled with the first coupled line. The first tapped line has a first central line which is spaced from an end face of the first coupled line at a first distance. The second tapped line has a second central line which is spaced from an end face of the second coupled line at a second distance. The first distance is larger than the second distance. As such, the performance of the step impedance resonator filter can be improved.

A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

Disclosed is a single notch filter, comprising a dielectric layer, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged onto two opposite surfaces of the dielectric layer, the first metal layer comprises a metal microstrip patch, the second metal layer comprises a coplanar waveguide plate and a metal grounding plate, and a fractal defected ground body of the coplanar waveguide plate is coupled with the metal microstrip patch based on the dielectric layer. Other embodiments are described and claimed.