A memory module operation system for operating in high stress environments with strong vibration. The application and use of a retainer to reduce and dampen the effects of system vibration and the application of dynamic loads can retain a memory module in place in a memory socket. Further, the retainer can operate to reduce the effects of electromagnetic interference and can act as a heat transport system to reduce thermal stress on components.

The present disclosure is related to electronic devices. At least some embodiments of the present disclosure relate to an electronic device comprising a circuit board, a first connector, and a second connector. The first connector and the second connector are disposed on the circuit board. The first connector is different from the second connector. The second connector is adjacent to the first connector. The first connector is arranged along a reference line in a first direction, and the second connector is adjacent to the reference line in the first direction.

A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

The present invention relates to an FPC connector housing, more particular to a DDRS connector housing. The invention also relates to a method for producing the connector housing as well as to a cavity mold suitable for the production of the connector housing. The cavity mold comprises a double gating system with centrally positioned injection gates. The connector housing can be used in a connector for mounting on a flexible printed circuit (FPC) assembled in various kinds of electrical and/or electronic devices.

A data processor cartridge comprising a housing to accommodate two data processor assemblies, and further comprising: a first connector (2A) to receive a first data processor assembly (10); and a second connector (2B) to receive a second data processor assembly (11); and wherein the second connector (2B) is arranged to receive the second data processor in an inverted orientation as compared to the orientation in which the first connector receives the first data processor assembly.

A bidirectional signal pin module includes: a signal pin configured to electrically connect two objects; and a socket having a bent body shape including bent portions, and configured to fix the signal pin in either one of a horizontal direction and a vertical direction.

An electrical connector includes wafer assemblies coupled to a housing. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, and a ground frame coupled to the wafer body to provide electrical shielding for the leadframe. Each leadframe has signal contacts with mating ends extending from the wafer body for mating with mating signal contacts of a mating electrical connector. The mating ends are twisted 45° to define twisted mating interfaces. Each ground frame has ground shields extending from a ground plate along the mating ends of the signal contacts. The ground shields are twisted 45° relative to the ground plate to define twisted shield zones along the mating ends of the signal contacts.

A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

Plug and receptacle connectors for improving crosstalk are provided. The plug connector includes a first set of plug terminals, a second set of plug terminals, a first plate-shaped shielding member, and a second plate-shaped shielding member. The first set of plug terminals include first ground terminals and first signal terminals, where the first plate-shaped shielding member is provided below the first set of plug terminals. The first plate-shaped shielding member is welded to the first ground terminals and transversely crosses and covers the first signal terminals without contacting the first signal terminals. The second set of plug terminals include second ground terminals and second signal terminals, where the second plate-shaped shielding member is provided above the second set of plug terminals. The second plate-shaped shielding member is welded to the second ground terminals and transversely crosses and covers the second signal terminals without contacting the second signal terminals.

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.