A card edge connector with latches that improve the connector's reliability. The connector comprises a housing having a slot elongated in a longitudinal direction and a pair of towers disposed on opposite ends of the housing and extending in a vertical direction. A pair of latches are disposed in the towers, respectively. Each latch has a groove disposed above the respective tower for receiving a flange of a card inserted in the slot. Each latch has a clip disposed in its groove for engaging the flange of the card. The clips are configured to restrain movement of the card in the longitudinal direction, the vertical direction, and a transverse direction perpendicular to the longitudinal and vertical directions when the latches are in locked positions. Such a configuration enables more reliable connections and improves the connector's shock resistance while being compatible with cards having a variety of thicknesses.

A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.

An electrical connector includes a body and multiple conductive terminals. The body has an insertion slot. Each conductive terminal has a contact portion entering the insertion slot and a conductive portion passing downward beyond a bottom surface of the body. Each side of the insertion slot has first terminal groups and second terminal groups. The conductive portions of each first terminal group are located away from the insertion slot relative to the conductive portions of each second terminal group. The conductive portions are provided in four rows in a lateral direction. The conductive terminals include signal terminals and ground terminals. The circuit board has an adjusting hole and four rows of connecting points corresponding to the conductive portions. Each row of the connecting points include multiple signal connecting points and multiple ground connecting points. The adjusting hole is located between two signal connecting points in two adjacent rows.

An electronic device includes a first interposer, a first integrated circuit (IC) device affixed to the first interposer, a second interposer, and a second IC device affixed to the second interposer. he second interposer is bonded to the first interposer. The first interposer includes first interposer circuitry and a first connection element electrically connected to the first interposer circuitry. The second interposer includes second interposer circuitry and a second connection element electrically connected to the second interposer circuitry. The second connection element is bonded to the first connection element to define a connection element pair. The connection element pair provides an electrical connection between the first interposer circuitry and the second interposer circuitry.

A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

An edge connector on a printed circuit board (“PCB”) uses a magnetic force to retain the PCB connected to another connector and to reduce the insertion force. In an example embodiment, a male edge connector includes a first magnetic connector and a female connector includes a second magnetic connector. A first force of attraction between the first magnetic connector and the second magnetic connector holds the male edge connector inserted into the female connector. The first force of attraction further reduces the force required to insert the male edge connector into the female connector.

[Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member. [Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface. In the gap forming portion, a concave portion is provided between a first end portion and a second end portion, and is configured to have a gap between the concave portion and the component mounting surface when the base portion is soldered on the component mounting surface in a state in which the concave portion and the component mounting surface are oriented in directions facing each other.

A connection assembly, including: a first connector having a first end and a second end, and a first surface extending between the first end and the second end, the first connector including press fit pins extending away from the first surface, each of the press fit pins including: a rod portion; a connecting portion having a first shape; a second connector having a first end and a second end, including: a dielectric carrier having a first surface extending between the first end and the second end of the second connector, receptacles positioned within the first surface of the dielectric carrier, each of the receptacles including: a cylindrical region, a tapered region having a second shape that corresponds to the first shape of the connection portion, wherein, when the first connector is coupled to the second connector, the press fit pins are positioned within respective receptacles of the receptacles.

A multi-piece connector is provided. The multi-piece connector includes a jumper conductor for electrically interconnecting parts of conductive terminals of the connector, without having to use any additional jumper, such that an electronic device having such a connector can be made more compact in size.