An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.

An I/O connector assembly configured for making a cabled connection to an interior portion of a printed circuit board for at least some signals passing through the I/O connector. The I/O connector assembly may be assembled by mounting a cage to a printed circuit board. A receptacle connector, including cables extending from a rear of the connector, may be inserted through an opening in the top or rear of the cage. The receptacle connector may be positioned in the cage by at least one retention member on the cage. A plug, mating to the receptacle connector, also may be positioned by a retention member on the cage. Positioning both the plug and receptacle relative to the cage reduces the tolerance stackup of the assembly and enables the connectors to be designed with shorter wipe length, which enables higher frequency operation.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. The leadframe assemblies may each have signal mating ends extending from the signal conductive elements and ground mating ends extending from the ground shield. High frequency performance may be achieved with features on the leadframe housing and on the ground shield. The features may be simple to form yet ensure the positional relationship between the contacts points of the ground mating ends and the contact points of the signal mating ends to sustain forces generated during operating the connector to mate with another connector and/or mount to a board.

The technology of this application relates to a connector assembly including a metal housing, a conducting piece, a wire, and a shield layer. The metal housing includes a shield cavity. The conducting piece is accommodated in the shield cavity. The wire is partially located in the shield cavity and is electrically connected to one end of the conducting piece. The shield layer is wrapped around the wire. At least two electrical connecting parts are disposed on an outer surface of the shield layer. The at least two electrical connecting parts face different directions and are respectively electrically connected to parts, of the metal housing, that the at least two electrical connecting parts face, to reduce impact of crosstalk of the connector assembly. The connector assembly is intended to reduce impact of crosstalk of the connector assembly, to provide the connector assembly and the electronic device that meet an application requirement of 112 Gbps.

The technology of this application relates to a connector assembly including a metal housing, a conducting piece, a wire, and a shield layer. The metal housing includes a shield cavity. The conducting piece is accommodated in the shield cavity. The wire is partially located in the shield cavity and is electrically connected to one end of the conducting piece. The shield layer is wrapped around the wire. At least two electrical connecting parts are disposed on an outer surface of the shield layer. The at least two electrical connecting parts face different directions and are respectively electrically connected to parts, of the metal housing, that the at least two electrical connecting parts face, to reduce impact of crosstalk of the connector assembly. The connector assembly is intended to reduce impact of crosstalk of the connector assembly, to provide the connector assembly and the electronic device that meet an application requirement of 112 Gbps.

An electrical connector includes a differential signal pair. A portion of each terminal is disposed in an insulative housing and an electrically conductive shield extends around at least a portion of the terminals and a least a portion of the housing. The housing may have a lower surface and a projection extending downward from the lower surface between a portion of a vertical section of each of the terminals. The terminals may have an angled section including a vertical portion having a first width, an angled portion narrower than the vertical portion, and a horizontal portion narrower than the angled portion. The housing may have a housing mating component spaced from a housing body component and aligned with but spaced from the terminals. The terminals may have a planar termination section with a first portion wider than a second portion.

An electrical connector includes a differential signal pair. A portion of each terminal is disposed in an insulative housing and an electrically conductive shield extends around at least a portion of the terminals and a least a portion of the housing. The housing may have a lower surface and a projection extending downward from the lower surface between a portion of a vertical section of each of the terminals. The terminals may have an angled section including a vertical portion having a first width, an angled portion narrower than the vertical portion, and a horizontal portion narrower than the angled portion. The housing may have a housing mating component spaced from a housing body component and aligned with but spaced from the terminals. The terminals may have a planar termination section with a first portion wider than a second portion.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space