A corrected mesa structure for a VCSEL device is particularly configured to compensate for variations in the shape of the created oxide aperture that result from anisotropic oxidation. In particular, a corrected mesa shape is derived by determining the shape of an as-created aperture formed by oxidizing a circular mesa structure, and then ascertaining the compensation required to convert the as-created shape into a desired (“target”) shaped aperture opening. The compensation value is then used to modify the shape of the mesa itself such that a following anisotropic oxidation yields a target-shaped oxide aperture.

Trenched VCSEL emitter structures are described. In an embodiment, an emitter structure includes a cluster of non-uniformly distributed emitters in which each emitter includes an inside mesa trench and an oxidized portion of an oxide aperture layer extending from the inside mesa trench. An outside moat trench is located adjacent the inside mesa trench and is formed to a depth past the oxide aperture layer.

A multi-junction VCSEL is formed by as a compact structure that reduces lateral current spreading by reducing the spacing between adjacent active regions in the stack of such regions used to from the multi-junction device. At least two of the active regions within the stack are located adjacent peaks of the intensity profile of the VCSEL, with an intervening tunnel junction positioned at a trough between the two peaks. The alignment of the active regions with the peaks maximizes the generated optical power, while the alignment of the tunnel junction with the trough minimizes optical loss. The close spacing on adjacent peaks forms a compact structure (which may even include a cavity having a sub-λ optical length) that lessens the total path traveled by carriers and therefore reduces lateral current spread.

An exemplary embodiment of the invention relates to a method of fabricating a radiation emitter (100) comprising the steps of fabricating a layer stack (10) that comprises a first reflector (12), an active region (13), an oxidizable layer (21-24), and a second reflector (14); and locally removing the layer stack (10), and thereby forming a mesa (M) of the radiation emitter (100), wherein said mesa (M) comprises the first reflector (12), the active region (13), the oxidizable layer (21-24) and the second reflector (14), wherein before or after locally removing the layer stack (10) and forming said mesa (M) the following steps are carried out: vertically etching blind holes (30) inside the layer stack (10), wherein the blind holes (30) vertically extend at least to the oxidizable layer (21-24) and expose the oxidizable layer (21-24); and oxidizing the oxidizable layer (21-24) via the sidewalls (31) of the blind holes (30) in lateral direction, wherein from each hole an oxidation front (32) radially moves outwards and wherein the etching is terminated before the entire oxidizable layer (21-24) is oxidized, thereby forming at least two unoxidized apertures, (40) each of which is limited by at least three oxidation fronts (32), inside the mesa.

A light emitting element formed of a laminate having a current constriction layer includes: a semiconductor substrate; a light emitting portion having plural first recess portions having a depth reaching the current constriction layer, and a current constriction structure formed in the current constriction layer and having an oxidized region where the current constriction layer is oxidized and a non-oxidized region surrounded by the oxidized region; an electrode pad disposed between the light emitting portion and an outer edge portion of the semiconductor substrate; and a step portion disposed between the electrode pad and the light emitting portion and formed from an upper surface of the laminate to the current constriction layer, and the current constriction layer in a region surrounded by the step portion is the oxidized region except for the non-oxidized region.

An embodiment discloses a vertical cavity surface emitting laser including a substrate, a lower reflective layer disposed on the substrate, a laser cavity including an active layer and disposed on the lower reflective layer, an oxide layer disposed on the laser cavity, an upper reflective layer disposed on the oxide layer, a plurality of first holes formed in the upper reflective layer and the oxide layer, and an upper electrode disposed on inner sides of the plurality of first holes and disposed on the upper reflective layer, wherein the oxide layer includes a plurality of light emitting regions spaced apart from each other, and the plurality of first holes are disposed to surround each of the light emitting regions in a plan view.

A vertical cavity surface emitting laser (VCSEL) device includes an oxide aperture layer positioned in close proximity to the active region of the device, typically within the cavity itself, as opposed to being positioned in the top DBR of the VCSEL. Reducing the spacing between the active region and the oxide aperture layer has been found to reduce the spread of current across the surface of the active region, allowing for a lower threshold current to be achieved. The closer positioning of the oxide aperture layer also reduced optical absorption and series resistance. The oxide aperture layer may be located at the first null in the standing wave pattern between the active region and the top DBR to minimize divergence of the beam and control the optical mode.

An array of surface-emitting lasers is provided. The array outputs high brightness in a unipolar way. The array comprises a stress-adjustment unit and a plurality of epitaxial device units. The stress-adjustment unit is used to adjust stress. The stress from a substrate is used to select a laser mode for an aperture unit. The selection of the laser mode is enhanced for the aperture unit without sacrificing driving current. Low current operation is achieved in a single mode for effectively reducing volume and further minimizing the size of the whole array to achieve high-quality laser output. An object can be scanned by the outputted laser to obtain a clear image with a high resolution. Hence, the present invention is applicable for face recognition with high recognition and high security.

A surface-emitting laser includes a first reflector layer, an active layer provided on the first reflector layer, and a second reflector layer provided on the active layer. The second reflector layer includes a corner reflector that tapers in a direction opposite to the first reflector layer, and the corner reflector has a plan shape of a circle or a polygon with an even number of vertexes.

In some implementations, a vertical cavity surface emitting laser (VCSEL) includes a substrate layer and epitaxial layers on the substrate layer. The epitaxial layers may include an active layer, a first mirror, a second mirror, and one or more oxidation layers. The active layer may be between the first mirror and the second mirror, and the one or more oxidation layers may be proximate to the active layer. The one or more oxidation layers may be configured to control beam divergence of a laser beam emitted by the VCSEL based on at least one of: a quantity of the one or more oxidation layers, a shape of the one or more oxidation layers, a thickness of the one or more oxidation layers, or a proximity of the one or more oxidation layers to the active layer.