An amplifier includes a first input transistor, a second input transistor, a first cascode transistor, a second cascode transistor, a first current mirror circuit, and a second current mirror circuit. The first input transistor is coupled to a first input terminal. The second input transistor is coupled to a second input terminal and the first input transistor. The first cascode transistor is coupled to the first input transistor. The second cascode transistor is coupled to the second input transistor and the first cascode transistor. The first current mirror circuit is coupled to the first cascode transistor, the second cascode transistor, and the first input terminal. The second current mirror circuit is coupled to the first cascode transistor, the second cascode transistor, and the second input terminal.

An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. Each antenna element may include a dual-pole antenna having a vertical feed and a horizontal feed. The beam former circuit may be (i) disposed in the package, (ii) have a plurality of pairs of ports, (iii) configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) configured to receive the radio-frequency signals at the ports while in a receive mode. Each pair of the ports is configured to be directly connected to a respective one of the antenna elements. All of the ports may be spatially routed into alignment with the vertical feeds and the horizontal feeds in a single conductive plane of the antenna array.

There is provided a printer including a motor configured to convey a medium and a processor configured to control the motor. The processor acquires a signal corresponding to a counterelectromotive force of the motor and performs predetermined processing based on the acquired signal.

A power amplifier circuit includes a first amplifier that amplifies an input signal and outputs an output signal; a second amplifier that, in accordance with a control signal, amplifies a signal corresponding to the input signal, generates a signal having an opposite phase to that of the output signal, and adds the signal to the output signal; and a control circuit that supplies the control signal to the second amplifier. The control circuit outputs the control signal so that during operation of the power amplifier circuit in a first power mode, a gain of the second amplifier is not less than zero and less than a predetermined level and during operation in a second power mode lower than the first power mode in output power level, a gain of the second amplifier is not less than the predetermined level and less than a gain of the first amplifier.

In one example an amplifier includes a bias circuit, an open-loop gain stage including a first PMOS having a gate coupled to a first node, a source coupled to a second node, a drain coupled to a third node, and a bulk coupled to the bias circuit, a second PMOS having a gate coupled to a ground node, a source coupled to the second node, a drain coupled to a fourth node, and a bulk coupled to the bias circuit, a first NMOS having a drain and a gate coupled to the third node and a source coupled to a fifth node, a second NMOS having a drain coupled to the fourth node, a gate coupled to the third node, and a source coupled to the fifth node, an adjustable resistor coupleable between the third and fourth nodes, and a buffer stage coupled to the open-loop gain stage.

An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. Each antenna element may include a dual-pole antenna having a vertical feed and a horizontal feed. The beam former circuit may be (i) disposed in the package, (ii) have a plurality of pairs of ports, (iii) configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) configured to receive the radio-frequency signals at the ports while in a receive mode. Each pair of the ports is configured to be directly connected to a respective one of the antenna elements. All of the ports may be spatially routed into alignment with the vertical feeds and the horizontal feeds in a single conductive plane of the antenna array.

In examples, a system comprises a differential amplifier coupled to a parasitic capacitor positioned between a first node and a first reference voltage source. The system comprises a buffer amplifier having an input terminal and an output terminal, the input terminal coupled to the first node and the output terminal coupled to a cancellation capacitor. The system includes a controlled current source coupled to the first node and the input terminal, the controlled current source coupled to a second reference voltage source. The system comprises a current sense circuit coupled to the cancellation capacitor and the second reference voltage source.

An apparatus includes a package and a chip. The package may comprise (i) a plurality of bonding pads, (ii) a plurality of combiner/splitter circuits, and (iii) a plurality of bumps. The bonding pads may be configured to electrically connect the package with a printed circuit board substrate. The combiner/splitter circuits generally connect each of the bonding pads to two respective bumps of the plurality of bumps. The chip is generally disposed in the package. The chip may comprise a plurality of contact pads and a plurality of transceiver channels. Each of the transceiver channels may comprise a radio-frequency input and a radio-frequency output. The radio-frequency input and the radio-frequency output of each transceiver channel are generally connected to respective contact pads of the chip. The respective contact pads of each transceiver channel are generally coupled to a respective bonding pad of the package via the two respective bumps.

A power amplifier circuit includes lower-stage and upper-stage differential amplifying pairs, a combiner, first and second inductors, and first and second capacitors. First and second signals are input into the lower-stage differential amplifying pair. The upper-stage differential amplifying pair outputs first and second amplified signals. The combiner combines the first and second amplified signals. The lower-stage differential amplifying pair includes first and second transistors. A supply voltage is supplied to the collectors of the first and second transistors. The first and second signals are supplied to the bases of the first and second transistors. The upper-stage differential amplifying pair includes third and fourth transistors. A supply voltage is supplied to the collectors of the third and fourth transistors. The emitters of the third and fourth transistors are grounded via the first and second inductors and are connected to the first and second transistors via the first and second capacitors.

A semiconductor integrated circuit including a differential amplifier circuit, a first output circuit, a second output circuit, a selection circuit, and a feedback circuit. The differential amplifier circuit is configured to operate at a first source voltage. The first output circuit is configured to receive an output of the differential amplifier circuit, output a first output, and operate at the first source voltage. The second output circuit is configured to receive an output of the differential amplifier circuit, output a second output, and operate at a second source voltage lower than the first source voltage. The selection circuit is configured to select one of the first output from the first output circuit and the second output from the second output circuit according to an operating phase determined by an external control signal. The feedback circuit is connected between the differential amplifier circuit and the selection circuit. The feedback circuit is configured to feed the selected output back to the differential amplifier circuit.