A vibrator device has a base, a semiconductor element having an oscillation circuit, and a vibrator having an excitation electrode sequentially stacked and includes a first wire electrically coupling between the excitation electrode and the semiconductor element, a second wire electrically coupling between a second external terminal as an external output terminal placed on the base and the semiconductor element, and a shield wire placed between at least a part of the first wire and at least a part of the second wire.

A vibration device has a substrate, a mount disposed on the substrate, a vibration element having a base end and a tip end, the base end being disposed on the mount, and an adhesive fixing the mount and the vibration element. The mount has a first protrusion and a second protrusion disposed to be aligned in a first direction in which the base end and the tip end are aligned, and whose protrusion heights on the vibration element side differ from each other, the second protrusion is located on the base end side of the vibration element relative to the first protrusion, the vibration element is disposed on the first protrusion and the second protrusion, and a portion of the vibration element on the base end side relative to the second protrusion is separated from the substrate and the mount.

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.

In an electronic component, a chip includes a vibrating functional part and a terminal on a first surface thereof. An intermediate member is stacked on the first surface. The intermediate member includes a first through hole above the functional part and surrounds the functional part in plan view. A lid is stacked on a surface of the intermediate member on the opposite side from the chip and closes the first through hole. A bonding member includes an upper end located on the opposite side of the lid from the intermediate member. The intermediate member surrounds the terminal as well as the functional part. The lid includes a second through hole overlapping the terminal out of the functional part and the terminal. The bonding member includes a center portion located inside the second through hole and a lower end located inside the first through hole and bonded to the terminal.

A vibration element includes a vibrating part, and a support part which is coupled to the vibrating part to support the vibrating part, wherein the vibrating part and the support part have a first surface and a second surface having a front and back relationship with the first surface, a first electrode is disposed on the first surface, the first electrode includes a first layer as a foundation layer, and a second layer as an upper layer of the first layer, when performing zoning into a first area where the first electrode is not disposed, a second area where the first layer and the second layer are stacked on one another, and a third area where the first layer is formed, identification symbols formed of two or more of the first to third areas are disposed, and an identification code formed of a plurality of the identification symbols is provided.

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, and a package base having a first principal surface and a second principal surface having an opposed surface relationship with each other, the quartz crystal resonator element is mounted on the first principal surface side, the thermistor is housed in a recessed section of the second principal surface side of the package base, a plurality of electrode terminals connected to the quartz crystal resonator element or the thermistor is disposed on the second principal surface side of the package base, and a distance in a first direction perpendicular to the first principal surface from a mounting surface of the electrode terminals to the thermistor is equal to or longer than 0.05 mm.

A piezoelectric vibration device that includes a piezoelectric vibrator having excitation electrodes formed thereon; a base having the piezoelectric vibrator on a first surface thereof; outer electrodes formed to continuously extend from the first surface of the base through a side face of the base to a second surface of the base opposite the first surface; and a lid having a recess opening that faces the first surface of the base, the lid being joined to the base to hermetically seal the piezoelectric vibrator in an internal space defined by the recess and the base. An edge portion of a corresponding one of the outer electrodes, formed by the first surface and the side face of the base, is at least partly covered by a covering member having insulating properties.

An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

A vibrator device includes: a base having a first surface and a second surface in a front-back relationship with each other; a circuit element located at a first surface side of the base and having a third surface at the first surface side and a fourth surface in a front-back relationship with the third surface; a vibrator element located at a fourth surface side of the circuit element; a first bonding member that bonds the base to the circuit element; a second bonding member that bonds the circuit element to the vibrator element; and a lid bonded to the base so as to form a cavity that accommodates the circuit element and the vibrator element between the lid and the base, in which at least a part of the second bonding member overlaps the first bonding member in a plan view of the circuit element.

A crystal resonator includes: lower glass plates on which first electrodes are formed so as to extend from side surfaces to a bottom surface of the lower glass plates; a crystal plate which is provided over the lower glass plates and on which second electrodes to be coupled to the first electrodes are formed on a surface in contact with the lower glass plates; and an upper glass plate which is provided over the crystal plate; wherein the side surfaces of the lower glass plates on which the first electrodes are formed are provided with a protrusion that extends in parallel with a top surface and the bottom surface of the lower glass plates and that extends from one end to the other end of each of the side surfaces, and wherein the first electrodes are formed on the side surfaces that include surfaces of the protrusion.