A bulk acoustic wave (BAW) resonator includes: an acoustic reflector disposed in a substrate; a lower electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the lower electrode; and an upper electrode disposed over the piezoelectric layer. A contacting overlap of the lower electrode, the piezoelectric layer and the upper electrode over the acoustic reflector comprising an active area of the BAW resonator. An opening exists in the upper electrode in a region of the BAW resonator susceptible to unacceptable overheating.

A resonant circuit includes: a capacitor of which a capacitance is variable; and an acoustic wave resonator to which the capacitor is connected in series and/or in parallel, a capacitance of the acoustic wave resonator being to be changed so that a change in input impedance and/or output impedance is reduced when the capacitance of the capacitor is changed.

A filter module includes filters. Each of the filters is configured to control communications bands having overlapping bandwidths each with the other. Each of the communications bands, allocated to any one of the filters, has a different limit frequency from the other.

A piezoelectric thin film resonator includes: a substrate; a lower electrode and an upper electrode located on the substrate; a piezoelectric film, at least a part of the piezoelectric film being sandwiched between the upper electrode and the lower electrode, the piezoelectric film including a discontinuous portion in which the piezoelectric film discontinues in at least a part of a region surrounding a center region that includes a center of a resonance region where the upper electrode and the lower electrode face each other across the at least a part of the piezoelectric film.

An acoustic wave filter includes a substrate having voids formed therein; a first resonator disposed on one or more of the voids, and a second resonator disposed on other of the voids. A first trimming layer is provided in the first resonator, and a second trimming layer is provided in the second resonator. The second trimming layer is formed of a material having an etching rate for a given etchant different from that of the first trimming layer.

A piezoelectric thin film resonator includes: a piezoelectric film located on a substrate, and formed of stacked lower and upper piezoelectric films; lower and upper electrodes facing each other across at least a part of the piezoelectric film; and an insertion film inserted between the lower and upper piezoelectric films, wherein an air gap including a resonance region where the lower and upper electrodes face each other across the piezoelectric film and being larger than the resonance region is located under the lower electrode, and a multilayered film formed of the lower piezoelectric film, the insertion film, and the upper piezoelectric film is located in at least a part of a region located further out than an outer outline of the resonance region, further in than an outer outline of the air gap, and surrounding the resonance region, and is not located in a center region of the resonance region.

The present invention relates to a filter chip (1), comprising an interconnection of at least one first and one second resonator (2, 3) operating with bulk acoustic waves, wherein the first resonator (2) operating with bulk acoustic waves comprises a first piezoelectric layer (4) that is structured in such a way that the first resonator (2) has a lower resonant frequency than the second resonator (3).

An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.

The present disclosure provides a bulk acoustic wave (BAW) filter structure and a preparation method thereof. According to the present disclosure, piezoelectric film elements are formed on a surface of an epitaxial substrate to form a transfer structure; resonant regions are defined on a supporting substrate and covered with bonding units to obtain a bonding structure; upper and lower surfaces of the transfer structure are reversed, and bottom electrode units are bonded to the resonant regions correspondingly one to one to obtain a BAW structure; and the epitaxial substrate is removed, and top electrode units are formed on surfaces of the piezoelectric film elements that are in contact with the epitaxial substrate previously. The BAW filter structure of the present disclosure can achieve batch production with low cost, high efficiency and high yield.