A bulk acoustic wave (BAW) resonator is disclosed. The BAW resonator includes: a lower electrode; a piezoelectric layer disposed over the lower electrode; and an upper electrode over the piezoelectric layer. An opening having a first area exists in and extends completely through the upper electrode. The BAW resonator also includes a substrate disposed below the lower electrode; a cavity; and a pillar disposed in the cavity and extending to contact a portion of the lower electrode disposed beneath the opening. The pillar has a second area that is less than the first area. There are no electrical connections that extend across the opening from one side to another.

A filter includes: series resonators connected to each other in series; shunt resonators connected to first nodes between some of the series resonators; and a variable capacitor connected to a second node between some of the series resonators, and forming a pole configured to suppress harmonics.

An acoustic wave filter includes series resonators and parallel resonators that have a piezoelectric film on an identical substrate and have a lower electrode and an upper electrode, wherein: one of the series resonators and the parallel resonators have a temperature compensation film on a face of the lower electrode or the upper electrode that is opposite to the piezoelectric film in a resonance region, the compensation film having an elastic constant of a temperature coefficient of which sign is opposite to a sign of a temperature coefficient of an elastic constant of the piezoelectric film; and the other have an added film on the same side as the temperature compensation film on the lower electrode side or the upper electrode side compared to the piezoelectric film in the resonance region in the one of the series resonators and the parallel resonators.

1. A method of fabricating an RF filter comprising an array of resonators comprising the steps of: Obtaining a removable carrier with release layer; Growing a piezoelectric film on a removable carrier; Applying a first electrode to the piezoelectric film; Obtaining a backing membrane on a cover, with or without prefabricated cavities between the backing film and cover; Attaching the backing membrane to the first electrode; Detaching the removable carrier; Measuring and trimming the piezoelectric film as necessary; Selectively etching away the piezoelectric layer to fabricate discrete resonator islands; Etching down through coatings and backing membrane to a silicon dioxide layer between the backing membrane and the cover to form trenches; Applying a passivation layer into the trenches and around the piezoelectric islands; Depositing a second electrode layer over the piezoelectric film islands and surrounding passivation layer; Applying connections for subsequent electrical coupling to an interposer; Selectively removing second electrode material leaving coupled resonator arrays; Creating a gasket around perimeter of the resonator array; Thinning down cover to desired thickness; Optionally fabricating upper cavities between the backing membrane and cover by drilling holes through the cover and then selectively etching away the silicon dioxide; Dicing the wafer into flip chip single unit filter arrays; Obtaining an interposer; Optionally applying a dam to the interposer surface to halt overfill flow; Coupling the flip chip single unit filter array to pads of the interposer by reflow of the solder cap; Encapsulating with polymer underfill/overfill; and Singulating into separate filter modules, wherein wherein the piezoelectric layer comprises a mixed AlN single crystal layer a c-axis orientation.

A coupled resonator filter includes a first resonator, a second resonator, one or more intervening layers, a first border ring, and a second border ring. The first resonator includes a first piezoelectric layer and a first electrode in contact with the first piezoelectric layer. The second resonator includes a second piezoelectric layer and a second electrode in contact with the second piezoelectric layer. The one or more intervening layers are between the first resonator and the second resonator and acoustically couple the first resonator and the second resonator. The first border ring is on the first electrode. The second border ring is on the second electrode. By providing both the first border ring and the second border ring, spurious modes in the coupled resonator filter may be suppressed, thereby improving the performance thereof.

Aspects of this disclosure relate to an acoustic wave device that includes a bulk acoustic wave resonator and a Lamb wave element implemented on a common substrate. In some instances, the bulk acoustic wave resonator can be a film bulk acoustic wave resonator. Related radio frequency modules and wireless communication devices are disclosed.

Aspects of this disclosure relate to acoustic wave filters that include a Lamb wave resonator and a second acoustic wave resonator that is a different type of acoustic wave resonator than the Lamb wave resonator. The different type of resonator can be a film bulk acoustic wave resonator for example. Some embodiments of this disclosure relate to an acoustic wave filter that includes the Lamb wave resonator and the second acoustic wave resonator. Some embodiments of this disclosure related to different respective acoustic wave filters including the Lamb wave resonator and the second acoustic wave resonator, in which the Lamb wave resonator and the second acoustic wave resonator an implemented on a common substrate.

Aspects of this disclosure relate to an acoustic wave filter configured to filter a radio frequency signal and a loop circuit coupled to the acoustic wave filter. The loop circuit is configured to generate an anti-phase signal to a target signal at a particular frequency. The loop circuit includes a Lamb wave element. Related radio frequency modules and wireless communication devices are disclosed.

An acoustic resonator device includes a bottom electrode disposed on a substrate over an air cavity, a first piezoelectric material layer disposed on the bottom electrode, an electrically-isolated layer of high-acoustic-impedance material disposed on the first piezoelectric material layer, a second piezoelectric material layer disposed on the electrically-isolated layer of high-acoustic impedance material, and a top electrode disposed on the second piezoelectric material layer, where an overlap among the top electrode, the first piezoelectric material layer, the electrically-isolated layer of high-acoustic-impedance material, the second piezoelectric material layer, and the bottom electrode over the air cavity defines a main membrane region.

A filter includes: a first substrate; first and second piezoelectric thin film resonators located on the first substrate, each of the resonators including first and second electrodes facing each other across a piezoelectric film, a crystal orientation from the first electrode to the second electrode of the piezoelectric film being the same between the resonators, the first electrodes of the resonators connecting to each other in a connection region between resonance regions where the first and second electrodes face each other across the piezoelectric film, the second electrodes of the resonators failing to connect to each other, and an area of the resonance region being approximately the same between the resonators, a second substrate mounting the first substrate across an air gap; and a ground pattern located on the second substrate and not overlapping with the first electrode located in the resonance regions and the connection region.