H03H9/588

System and method for a radio frequency filter

In accordance with an embodiment, an RF system includes a transmit path having a transmit RF filter and an adjustable transmit phase shifter/matching network coupled between the transmit RF filter and a transmit antenna port, where the adjustable transmit phase shifter/matching network is configured to transform an impedance of the transmit RF filter at a receive frequency from a first lower impedance to a first higher impedance at the transmit antenna port; and a receive path having a receive RF filter and an adjustable receive phase shifter/matching network coupled between the receive RF filter and a receive antenna port, where the adjustable receive phase shifter/matching network is configured to transform an impedance of the receive RF filter at a transmit frequency from a second lower impedance to a second higher impedance at the receive antenna port.

Acoustically coupled resonator notch and bandpass filters

A notch filter includes an inductor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

Acoustically coupled resonator notch and bandpass filters

A bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

System and method for a radio frequency filter

In accordance with an embodiment, a method of operating an RF system includes generating a first RF signal having a first frequency; filtering the generated first RF signal to form a first filtered transmitted signal; producing a first coupled signal and a first transmitted signal from the first filtered transmitted signal; transmitting the first transmitted signal; transmitting a second RF signal having a second frequency; bandpass filtering the first coupled signal to form a first tunable bandpass filtered signal; and measuring a parameter of the first tunable bandpass filtered signal.

Tunable resonator element, filter circuit and method

A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second or third resonator or both. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second or third resonator or both to enable tuning of the resonator element. The tuning circuit includes a variable capacitor and an inductor.

System and method for a radio frequency filter

In accordance with an embodiment, a method of operating an RF system includes filtering a first wideband RF signal using a wideband filter bank. Filtering the first RF signal includes separating the first wideband RF signal into frequency cluster signals, where each frequency cluster signal of the frequency cluster signals includes different frequency ranges, the first wideband RF signal includes multiple RF bands, and each of the different frequency ranges comprises a plurality of RF bands of the multiple RF bands. The method further includes band stop filtering at least one of the frequency cluster signals to produce a band stopped frequency cluster signal.

Acoustically coupled resonator notch and bandpass filters

A notch filter includes a first inductor coupled between an input node and an output node, a dual-resonator structure coupled between the input node and the output node, and a second inductor coupled between the dual-resonator structure and ground, and a bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

Packages with Organic Back Ends for Electronic Components
20210028766 · 2021-01-28 ·

A packaged electronic component comprising: an electrical element packaged within a package comprising a front part of a package comprising an inner section with a cavity therein opposite the resonator defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads that are coupleable in a flip chip configuration to a circuit board.

System and method for a radio frequency filter

In accordance with an embodiment, a method of operating an RF system includes filtering a wideband RF signal using an adjustable center frequency bandpass filter to produce a filtered RF signal; amplifying the filtered RF signal to produce an amplified RF signal; and band stop filtering the amplified RF signal to produce a band stopped RF signal.

Method of fabricating novel packages for electronic components

A method of fabricating packaged electronic components with improved yield and at lower unit cost; the method comprising the steps of obtaining an active membrane layer on a carrier substrate, depositing a front electrode onto a front of the active membrane layer, obtaining an inner front section including at least a silicon handle or wafer, attaching an inner front end section to an outer surface of the front electrode, detaching the carrier substrate from a back surface of an active membrane on the opposite surface from the front surface on which the front electrode is deposited, patterning the active membrane layer into an array of at least one island of membrane, selectively removing the front electrode and bonding layer, selectively applying an inner passivation layer, and selectively depositing a back electrode layer on the thus exposed back surface of the active membrane.