Patent classifications
H04R1/2846
MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS Package
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
Microphone assembly with back volume vent
The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microphone assembly. This is achieved by fabricating an aperture reduction structure using a separate dedicated die, with an aperture of diameter ˜25 microns or less disposed on the aperture reduction structure, and then coupling the aperture reduction structure to the cover of the microphone. The relatively smaller aperture on the cover after the coupling of the aperture reduction structure is used for pressure equalization of the back volume of the microphone with a pressure outside of the microphone assembly.
SOUND PORT ADAPTER FOR MICROPHONE ASSEMBLY
A one-piece sound port adapter for a microphone assembly includes a body member configured to be fitted over a sound port of the microphone assembly. The body member includes an acoustic channel defined in part by a cavity having a sound inlet and a sound outlet, where the sound outlet is acoustically coupled to the sound port. A wall portion of the body member extends into the cavity and configured to modify an acoustic property of the acoustic channel. When mounted, the one-piece sound port adapter converts the microphone assembly from a top or bottom port microphone assembly to a side-port microphone assembly.
VENTED ACOUSTIC TRANSDUCERS, AND RELATED METHODS AND SYSTEMS
An electronic device has an acoustic transducer with an acoustic diaphragm. The diaphragm has opposed first and second major surfaces. A front volume is positioned adjacent the first major surface. A back volume is positioned adjacent the second major surface. An elongated channel defines a barometric vent and extends from a first end fluidly coupled with the front volume to a second end fluidly coupled with the back volume, fluidly coupling the front volume with the back volume. The elongated channel may have a high aspect ratio (L/D), providing the vent with a substantial air mass. The elongated channel may be segmented to define a higher-order filter. For example, a segmented channel can have a cascade of repeating acoustic-mass and acoustic-compliance units, providing the barometric vent with additional degrees-of-freedom for tuning.
VENTED ACOUSTIC TRANSDUCERS, AND RELATED METHODS AND SYSTEMS
An electronic device has an acoustic transducer with an acoustic diaphragm. The diaphragm has opposed first and second major surfaces. A front volume is positioned adjacent the first major surface. A back volume is positioned adjacent the second major surface. An elongated channel defines a barometric vent and extends from a first end fluidly coupled with the front volume to a second end fluidly coupled with the back volume, fluidly coupling the front volume with the back volume. The elongated channel may have a high aspect ratio (L/D), providing the vent with a substantial air mass. The elongated channel may be segmented to define a higher-order filter. For example, a segmented channel can have a cascade of repeating acoustic-mass and acoustic-compliance units, providing the barometric vent with additional degrees-of-freedom for tuning.
Sound device and electronic device using sound device
The present invention provides a sound device and an electronic device using the sound device. The sound device includes a housing with an accommodating space, a sound unit accommodated in the housing and a control device arranged outside the housing. The sound unit divides the accommodating space into a front cavity and a rear cavity, and a through hole is arranged in a position of the housing corresponding to the rear cavity. The control device includes a sealing member sealing the through hole. When the control device presses the sealing member against the housing and the through hole is sealed by the sealing member, the sound device is in a first sound mode. When the control device disengages the sealing member from the housing and the through hole is not sealed by the sealing member, the sound device is in a second sound mode.
EARPHONE HAVING A CONTROLLED ACOUSTIC LEAK PORT
An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.
MEMS microphone
An MEMS microphone is provided, including a base having a back cavity, and a capacitor system disposed on the base, the capacitor system including a backplate and a diaphragm disposed oppositely to the backplate. The diaphragm includes a body portion and a plurality of venting portions connected to the body portion, each of the plurality of venting portions includes a venting aperture penetrating through the diaphragm and a membrane flap partially fixed to the diaphragm and located in the venting aperture. The MEMS microphone further includes an insulation connecting pillar having one end fixedly connected to the backplate and another end fixedly connected to the membrane flap. Compared with the related art, the venting portion is fixedly connected to the backplate through the insulation connecting pillar, so that the venting portion is not easily warped, thereby improving reliability of the MEMS microphone.
MICROPHONE ASSEMBLY WITH BACK VOLUME VENT
The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microphone assembly. This is achieved by fabricating an aperture reduction structure using a separate dedicated die, with an aperture of diameter 25 microns or less disposed on the aperture reduction structure, and then coupling the aperture reduction structure to the cover of the microphone. The relatively smaller aperture on the cover after the coupling of the aperture reduction structure is used for pressure equalization of the back volume of the microphone with a pressure outside of the microphone assembly.
SOUND DEVICE AND ELETRONIC DEVICE USING SOUND DEVICE
The present invention provides a sound device and an electronic device using the sound device. The sound device includes a housing with an accommodating space, a sound unit accommodated in the housing and a control device arranged outside the housing. The sound unit divides the accommodating space into a front cavity and a rear cavity, and a through hole is arranged in a position of the housing corresponding to the rear cavity. The control device includes a sealing member sealing the through hole. When the control device presses the sealing member against the housing and the through hole is sealed by the sealing member, the sound device is in a first sound mode. When the control device disengages the sealing member from the housing and the through hole is not sealed by the sealing member, the sound device is in a second sound mode.