The present invention provides a gas adsorbent comprising a number of microspheres formed by agglomeration of zeolite and adhesive. Among the plurality of microspheres, at least some of the microspheres have a porous structure and contain inflatable balls inside. In the present invention, the high molecular polymer expansion ball is added into the zeolite microsphere, and more pore structures are created in the zeolite microsphere by utilizing its characteristics of expansion, solidification and rupture at different temperatures. Thus, the adsorption capacity of the zeolite microsphere to air is increased to achieve a better frequency reduction effect.

A speaker includes a housing having a receiving space, a speaker unit and a cavity received in the receiving space, sound-absorbing particles filled in the filling cavity, a filling hole opened in the housing and communicating with the filling cavity for filling the sound-absorbing particles into the filling cavity, a hole cover covering the filling hole and a resilient member filled in the filling hole. The resilient member can deform in the height direction of the filling hole, and the resilient member is sandwiched in a compressed state between the hole cover and the sound-absorbing particles. Compared with the related art, the sound-absorbing particles of the speaker disclosed by the present disclosure are not easily damaged.

An electronic device having a speaker includes: a housing having a front wall member; a cover member detachably attached to the front wall member; a fastening member arranged behind the cover member and fastened to the housing; and a first elastic member provided between the cover member and the fastening member. The cover member, the fastening member, and the first elastic member are arranged inside the housing. The speaker is arranged between the front wall member and the cover member. The front wall member and the cover member are formed so that a closed space is defined by a back surface of a vibration plate, the front wall member, and the cover member. The front wall member is provided with an opening communicating from outside of the housing to the front surface of the vibration plate. The first elastic member contacts the cover member and the fastening member.

Provided is a sound-absorbing material, including an adsorbent material and a thermal conductive material. The thermal conductive material is uniformly dispersed in the sound-absorbing material. The thermal conductive material includes a carbon fiber material, and a weight ratio of the carbon fiber material in the sound-absorbing material is within a range of 0.05% to 10%. Further provided are a preparation method of the sound-absorbing material and a speaker using the sound-absorbing material. The sound-absorbing material has higher thermal conductivity and can be added to a rear cavity of the speaker to effectively conduct heat generated when the speaker is working, thereby improving the heat dissipation performance of the speaker.

The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, and a porous block installed in the back volume and prepared by mixing first porous particles having excellent adsorption capacity of nitrogen or oxygen and second porous particles having a porosity of 50% or more.

An electronic device including a speaker is provided. The electronic device includes a main housing, a cover housing connected to the main housing, a speaker provided inside the main housing and the cover housing, and a guide including a guide base seated on the main housing to support the speaker and a guide body extending from the guide base in a first direction and overlapping the speaker in a second direction perpendicular to the first direction.

The disclosure provides an electronic device including a substrate, a first vibrating unit, and a supporting unit. The substrate has a first surface. The first vibrating unit is disposed on the first surface and has a second surface. The second surface faces the first surface. The supporting unit is disposed between the substrate and the first vibrating unit. The first surface and the second surface are separated by a distance through the supporting unit. This distance ranges from equal to or greater than 0.06 mm to equal to or less than 65.4 mm.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Provided are a sound absorbing material encapsulation structure for a sound production device, and a sound production device. The sound absorbing material encapsulation structure comprises: a rigid cavity wall enclosed to form a cavity of the sound absorbing material encapsulation structure, the cavity is configured to accommodate a sound absorbing material, the rigid cavity wall is provided with air permeability holes arranged in an array, the air permeability holes are configured to form a channel for air to flow in and out of the sound absorbing material encapsulation structure, diameters of air permeability holes are smaller than a diameter of sound absorbing material; a bottom plate sealed and connected to one end surface of rigid cavity wall, the bottom plate is configured to support the sound absorbing material; a covering plate provided to cover another end surface of rigid cavity wall and sealed and connected to the rigid cavity wall.