Provided herein is a built-in speaker module. The built-in speaker module is installed in a housing of an electronic device having a first bottom surface spaced apart from a ground and a second bottom surface installed above the first bottom surface, and includes a speaker installed above the second bottom surface, a first vibration absorbing member interposed between the speaker and the second bottom surface, and a second vibration absorbing member interposed between the first bottom surface and the second bottom surface, wherein sound is emitted from the speaker through openings formed in the first bottom surface and the second bottom surface.

A sounding body contains: an accommodation chamber and at least one locking tab. A respective one of the at least one locking tab includes a fixing groove. The sounding body further contains a speaker unit which includes a fitting member having a cavity, and the cavity is engaged with a speaker. A first support loop is fitted on the fitting member and has multiple first extension portions, and each of the multiple first extension portions has a first positioning knob. The fitting member is fitted with a second support loop on which multiple second extension portions obliquely extend, and each of the multiple second extension portions has a second positioning knob engaged with the fixing groove of the respective one locking tab. Furthermore, a shock-absorbing space is defined between the speaker unit and the accommodation chamber.

An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing member and a transmission member. The sensing member protrudes from a front end of the shell and has a conductor. The sensing member is electrically connected to the sensing chip by the transmission member. A material of the sensing member is different from a material of the shell.

A system providing tactile sensations. The system comprises a seat back of a seat, the seat back having a left side and a right side separated by a center-line of the seat back. A first plurality of electroactive transducers are arranged along the center-line of the seat back and provide tactile sound to a user. A second plurality of electroactive transducers in the seat back provide tactile alerts or feedback. The second plurality of electroactive alert transducers comprise a left-side electroactive transducer at the left side of the seat back and right-side electroactive transducer at the right side of the seat back.

The present invention provides a mobile terminal, including: a housing including an upper cover, a lower cover covering the upper cover to form an accommodating space, and a sound channel penetrating through the upper cover; and a speaker unit accommodated in the accommodating space of the housing; the speaker unit dividing the accommodating space into a front sound cavity and a rear cavity; the sound channel communicating the front sound cavity with an outside; and where in, the speaker unit is fixed on the upper cover and enclosed together with the upper cover to from the front sound cavity; the sound channel is filled with a sound absorbing material.

An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.

Disclosed is an electronic apparatus comprising: an audio processor configured to process a sound signal; and a loudspeaker configured to output sound based on the sound signal, the loudspeaker comprising: a first driver; a second driver configured to output a frequency band higher than a frequency band output by the first driver; and a plate-shaped enclosure comprising a chamber accommodating the first driver and the second driver and a sound emission passage adjacent to the chamber, and the sound emission passage comprising: a first sound emission passage extending along an arrangement direction of the first driver and the second driver and having the first driver disposed therein; and a second sound emission passage extending along the arrangement direction of the first driver and the second driver inside the first sound emission passage and having the second driver disposed therein.

The present disclosure relates to a waterproof open earphone. The waterproof open earphone may include a housing, at least one button, at least one elastic pad, and at least one pair of speaker units. The housing may be placed on a head or at least one ear of a user while not blocking an ear canal of the user. The at least one button may be set on the housing, wherein each of the at least one button corresponds to a button hole. The at least one elastic pad may correspond to the at least one button, respectively, wherein each elastic pad prevents the corresponding button from moving relative to the button hole. Each pair of the at least one pair of speaker units may generate sound within a frequency range from two sound guiding holes through two sound guiding tubes.

In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.

The present disclosure relates to a display apparatus, and more particularly, to a display apparatus having a display panel capable of generating sound. A display apparatus according to the present disclosure includes: a display module; a guide panel disposed at circumferences of a rear surface of the display module; a back cover attached to the guide panel; a sound generating unit disposed between the display module and the back cover; and an adhesive fixing element and a vibration absorber disposed between the guide panel and the rear surface of the display module, wherein the adhesive fixing element fasten the guide panel to the rear surface of the display module, and wherein the vibration absorber is disposed at the guide panel as facing to inner portions of the display module.