A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A wiring substrate includes an insulating layer, a stack including wiring layers and photosensitive-resin insulating layers on a first surface of the insulating layer, a wiring layer on a second surface of the insulating layer, having a lower wiring density than the wiring layers, a metal core plate buried in the insulating layer and positioned on the stack side with respect to the center of the insulating layer in its thickness direction, and a via wiring buried in the insulating layer to have a first end face exposed at the first surface and joined to the lowermost one of the wiring layers, and a second end face joined to the metal core plate. The first surface and the first end face are substantially flush with each other. The wiring layers include a signal line, and a ground line concentrically formed around the signal line, with a predetermined interval therebetween.

A method for manufacturing an interconnect structure and an interconnect structure are provided. The method includes: forming an opening in a substrate; forming a low-k dielectric block in the opening; forming at least one via in the low-k dielectric block; and forming a conductor in the via. The interconnect structure includes a substrate, a dielectric block, and a conductor. The substrate has an opening therein. The dielectric block is present in the opening of the substrate. The dielectric block has at least one via therein. The dielectric block has a dielectric constant smaller than that of the substrate. The conductor is present in the via of the dielectric block.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.

An interconnect structure includes a substrate, a dielectric block, and a conductor. The dielectric block is in the substrate. A dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness. The conductor includes a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block.

A three-dimensional interconnect structure having a top surface, a first coaxial conductor, and a shielded chamber is disclosed. The first coaxial conductor is filled with a solid dielectric medium. The first coaxial conductor has a segment that runs parallel to the top surface and a segment connects the first coaxial conductor to the top surface. Conductive pads on the top surface are adapted to receive a signal and couple that signal to the first coaxial conductor at the top surface. The shielded chamber contains a device connecting two conductors that are part of the three-dimensional interconnect structure to one another in that chamber. The shielded chamber is filled with the solid dielectric medium. The structure is a solid block composed of a mixture of metal structures interspersed with the solid dielectric medium.

A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first conductive via extended through the first substrate; a second conductive via extended through the first substrate; and a third conductive via extended through the first substrate, wherein the second conductive via is disposed between the first conductive via and the third conductive via, the second conductive via is configured to connect to a signal source, and the first conductive via and the third conductive via are configured to connect to an electrical ground.

An impedance matching structure is disposed on a circuit board for matching an impedance of a transmission line for transmitting an electronic signal. The structure includes: at least two redundant conducting sections coupled to different points between an input terminal and an output terminal of the transmission line, wherein the redundant conducting sections are apart from one another, and a first terminal of each of the redundant conducting sections is coupled to the transmission line, while a second terminal of each of the redundant conducting sections is apart from the transmission line; and at least one grounded conducting section, each of which corresponds to one of the redundant conducting sections, and surrounds in separation from the corresponding redundant conducting section, wherein each of the at least two redundant conducting sections is disposed in a corresponding plating hole.

A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

A circuit board includes a board base with a first surface and a second surface that is located opposite the first surface. A plurality of first coupling pads are located on the first surface of the board base. A plurality of second coupling pads are located on the second surface of the board base. The first coupling pads and the second coupling pads define a coupling pad footprint. A breakout via system is included in the board base. The breakout via system includes a plurality of primary signal vias that are located in the board base and outside of the coupling pad footprint, a plurality of first primary signal via connections that extend between the primary signal vias and the plurality of first coupling pads, and a plurality of second primary signal via connections that extend between the primary signal vias and the plurality of second coupling pads.