A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer.

In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31) formed on the insulating substrate (10); a second signal line (L32) having a shorter length than that of the first signal line (L31); and a ground layer (30) formed for the first signal line (L31) and the second signal line (L31) via an insulating material (10). The ground layer (30) includes a first ground layer (G31) corresponding to a first region (D1) and a second ground layer (G32) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31) and has a first predetermined width (W31). The second region (D2) is defined based on the second signal line (L32) and has a second predetermined width (W32). The first ground layer (G31) has a remaining ratio lower than a remaining ratio of the second ground layer (G32).

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.

Disclosed herein are printed circuit boards (PCBs) with patterned ground structure filters and data storage devices comprising such PCBs. Each PCB comprises a resonator having an L-shape or a zig-zag shape in a plane of the printed circuit board and at least one signal trace. The resonator has a first dimension and a second dimension in the plane of the printed circuit board. A portion of the at least one signal trace is situated over the resonator and is separated by a distance from the resonator by a dielectric material. In some embodiments, at least part of the portion of the at least one signal trace extends in a same direction as the first dimension (in the case of an L-shaped resonator) or tracks the zig-zag shape of the resonator (in the case of a zig-zag-shaped resonator).

A circuit including a grounding layer, a pair of signal lines and an insulating layer is provided. The grounding layer has a void region. The void region includes a first straight line part, a second straight line part and a third straight line part. The second straight line part and the third straight line part are connected to two ends of the first straight line part. An orthogonal projection of the pair of signal lines on the grounding layer crosses the first straight line part. The insulating layer is disposed between the grounding layer and the pair of signal lines and separates the grounding layer from the pair of signal lines.

The present disclosure generally relates to a shielded three-layer patterned ground structure in a PCB. The PCB may be disposed in a hard disk drive. To reduce costs, PCBs are being made with only four total layers separated by dielectric material. Conductive traces in PCBs can have the problem of common mode current flowing through the traces and thus increasing the magnitude of EMI noise. By providing a shielded three-layer patterned ground structure, not only is the cost reduced, but so is the common mode current and the magnitude of EMI noise, all without any negative impact to the differential signal.

A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.