H05K1/0227

INTERFACE CIRCUIT, SUBSTRATE, ELECTRONIC DEVICE, AND PROGRAMMABLE CONTROLLER

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.

ELECTROMAGNETIC WAVE SHIELDING SHEET AND PRINTED WIRING BOARD

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

Transmission line design with routing-over-void compensation

Apparatus and methods are provided for ameliorating distortion issues associated with a conductor that passes over a void in a reference plane. In an example, the conductor can include a first part routed over a major surface of a first side of the reference plane structure and that approaches a first edge of the reference plane structure with a first trajectory, a second part routed over the major surface of a second side of the reference plane structure and that approaches a second edge of the reference plane structure with a second trajectory in-line with the first trajectory, and a third portion connecting the first portion with the second portion and having a third trajectory departing from the first trajectory and the second trajectory, the third portion configured to span the void.

SYSTEM OF PROVIDING POWER

A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

Optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS)
10833635 · 2020-11-10 · ·

Embodiments of the disclosure relate to optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS). A power amplifier circuit is provided in the remote unit to amplify a received input signal associated with a signal channel(s) to generate an output signal at an aggregated peak power. In this regard, a control circuit is configured to analyze at least one physical property related to the signal channel(s) to determine a maximum output power of the power amplifier circuit. Accordingly, the control circuit configures the power amplifier circuit according to the determined maximum output power. By configuring the maximum output power based on the signal channel(s) in the input signal, it may be possible to optimize the power efficiency of the power amplifier circuit, thus helping to reduce the power consumption of the remote unit.

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
20200352023 · 2020-11-05 ·

A printed circuit board includes a substrate having a top surface and a bottom surface. A reference plane is embedded in the substrate and adjacent to the top surface. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate, the first signal net and the second signal net. The outmost insulating layer comprises an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region in which the first signal net and the second signal net are arranged, such that the conductive layer overlaps with the first signal net.

Electromagnetic wave shielding sheet and printed wiring board

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

Wiring board
10804210 · 2020-10-13 · ·

A wiring board includes an insulating layer, and a metal layer, formed on the insulating layer, and including a first pattern that includes a plurality of wirings extending parallel to each other, and a second pattern that includes a degassing hole. The insulating layer includes a groove exposed between the plurality of wirings, and a surface of the insulating layer inside the degassing hole is located above a bottom surface of the groove.

Printed circuit board design for high speed application
10772191 · 2020-09-08 · ·

A printed circuit board includes a substrate having a top surface and a bottom surface. First non-ground nets and a ground net are disposed within a specific region on the top surface. A second non-ground net and a split ground net are disposed on the bottom surface. The second non-ground net is electrically connected to one of the first non-ground nets through a first via hole in the substrate. The second non-ground net is isolated from the split ground net by a gap. An outermost insulating layer on the bottom surface of the substrate covers the second non-ground net and the split ground net. A conductive layer is disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the first non-ground nets.

Pulsed electromagnetic field therapy system and method
10763565 · 2020-09-01 ·

System and method of applying pulsed electromagnetic fields (PEMF) to a human user's body. Here an electrically isolated antenna is applied to a portion of the body. This antenna is connected to a PEMF power source comprising a modified Blumlein dual transmission line transformer circuit with emphasis on miniaturization. Each transmission line comprises a substantially planar PC board mounted conducting strip configured in a meander pattern, and separated from at least one split ground plane by at least one substantially planar dielectric material and at least one split ground plane. This in turn is powered by a low voltage power supply, resonant transformer. The Blumlein circuit is charged and discharged by a processor controlled high-speed switch according to user selected time settings, and can produce outputs substantially above 1 kV. Relative to prior art devices, the system enables much smaller, lighter, and less costly PEMF implementations.