Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

A stator of an electric motor includes a stator core having a plurality of teeth. A printed circuit board (PCB) is fixed with respect to the stator and includes a plurality of soldering structures defined within a surface of the printed circuit board. A winding set is disposed on the teeth. The winding set includes at least one wire that is wound around the teeth to at least partially define stator poles. Each wire of the winding set includes opposing ends that are attached to the printed circuit board at a dedicated soldering structure of the plurality of soldering structures.

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

A high-speed transmission circuit comprises a connector pin that serves as part of a signal path, has a first conductivity, and has a connector pin leg that is coupled to a pad that has a second conductivity lower than the first conductivity. The connector pin leg and at least a portion of the pad form a resonant sub-circuit coupled to the signal path. The second conductivity causes a reduction in insertion loss in the signal path by damping a current in the resonant sub-circuit.

Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

One example described herein includes an integrated circuit (IC) package. The IC package includes a semiconductor die comprising an IC and an IC package enclosure that substantially encloses the semiconductor die. The IC package also includes at least one conductive metal contact. Each of the at least one conductive metal contact is coupled to the semiconductor die and comprises a planar solder surface exterior to the IC package enclosure to which the respective at least one metal contact is soldered to an external conductive metal contact. The planar solder surface includes at least one solder surface feature.

In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

A pin-aligned magnetic device is provided, which includes a first magnetic core body, a second magnetic core body, and a plurality of conductors. The first magnetic core body is internally disposed with a magnetic element, and the magnetic element is joined to the plurality of conductors. The second magnetic core body covers the plurality of conductors on the first magnetic core body, so that the plurality of conductors is mounted inside the magnetic device and pins thereof are exposed from two lateral sides of the magnetic device, to form a plurality of pins. The foregoing design makes room at the bottom of the magnetic device, thus facilitating space saving and utilization on a PCB board. Moreover, each pin can be in good electrical contact with the board, effectively enhancing product yield on a production line.