A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.

A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

A circuit board assembly and a method of manufacturing the same is provided, by which, when external pressure is applied to a cover, deformation of the cover caused by the external pressure is suppressed and no adverse effect is produced to electronic components on a circuit board. A cover of a circuit board assembly includes a first cover to cover a first surface of a circuit board and a second cover to cover a second surface of the circuit board. A projection portion projects from an inner surface of the first cover. When a complete circuit board assembly is formed by insert-molding using the circuit board assembly as an insert part, the projection portion suppresses deformation of the first cover and the second cover.

An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.

A motor stator includes a stator core, a winding wound around the stator core, and a circuit board connected with the winding. The circuit board forms a through hole. The through hole has an opening formed at an outer edge of the circuit board. A wire terminal of the winding slides into the through hole via the opening, and a distal end of the wire terminal is bent and soldered to a surface of the circuit board after passing through the through hole.

Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.