According to an embodiment of the present disclosure, a method for manufacturing an integrated circuit (IC) device may include mounting an IC chip onto a center support structure of a leadframe. The leadframe may include: a plurality of pins extending from the center support structure; a groove running perpendicular to the individual pins of the plurality of pins around the center support structure; and a bar connecting the plurality of pins remote from the center support structure. The method may further include: bonding the IC chip to at least some of the plurality of pins; encapsulating the leadframe and bonded IC chip, including filling the groove with encapsulation compound; removing the encapsulation compound from the groove, thereby exposing at least a portion of the individual pins of the plurality of pins; plating the exposed portion of the plurality of pins; and cutting the IC package free from the bar by sawing through the encapsulated lead frame along the groove using a first saw width less than a width of the groove.

A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.

One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.

An electronic component includes a body including internal electrodes; an insulating layer disposed on side surfaces of the body and at least one of an upper surface of the body and a lower surface of the body; and an external electrode disposed on an end surface of the body and connected to the internal electrodes. The external electrode extends to at least one of the upper surface of the body, the lower surface of the body, and the side surfaces of the body, and partially overlaps the insulating layer.

Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter.

A printed wiring board includes a power supply conductor pattern arranged on one conductor layer, one ground conductor pattern arranged on the one conductor layer, and another ground conductor pattern arranged on the another conductor layer so as to be opposed to the power supply conductor pattern. The power supply conductor pattern includes a power supply pad on which a terminal of a capacitor is to be bonded. The one ground conductor pattern includes a ground pad on which another terminal of the capacitor is to be bonded. A slit is formed in the another ground conductor pattern so as to pass through a projection portion defined by projecting the power supply pad onto the another ground conductor pattern and divide a projection portion defined by projecting the power supply conductor pattern onto the another ground conductor pattern.

A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

A stretchable mounting board that includes: a stretchable substrate; a mounting electrode portion on a main surface side of the stretchable substrate and containing a conductive filler and a resin; a solder portion connected to the mounting electrode portion; and an electronic component electrically connected to the mounting electrode portion with the solder portion interposed therebetween. The mounting electrode portion has a first main surface on a stretchable substrate side thereof, a second main surface on a solder portion side thereof, a first region including the first main surface, and a second region including the second main surface, and wherein, in a cross-section along a thickness direction of the mounting electrode portion passing through the first region and the second region, a sectional area of the conductive filler in the second region is larger than a sectional area of the conductive filler in the first region.

A multi-layer ceramic electronic component includes: a ceramic body including a main surface, an end surface, and a side surface respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another, a top portion that connects the main surface, the end surface, and the side surface to one another, and a plurality of internal electrodes laminated in a direction of the first axis; and an end external electrode including a corner portion located on the top portion, a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion located on the main surface and extending in directions of the second axis and the third axis from the corner portion.