Electromagnetic wave shielding material including a conductive fiber web with multiple pores and a heat dissipation unit provided in at least some pores that is so excellent in flexibility, elasticity, and creasing/recovery that it can be changed in shape freely and brought in complete contact with a surface where the material is to be disposed even if the surface has a curved shape, uneven portions, or stepped portions, thus exhibiting excellent electromagnetic wave shielding performance and prevent deterioration thereof despite various shape changes. Since heat dissipation performance is excellent, heat generated in an electromagnetic wave source can be rapidly conducted and released. Even if parts are provided in a narrow area at high density, the material can be brought in close contact with mounted parts by overcoming a tight space between the parts and a stepped portion. The invention is employed for light, thin, short, and small or flexible devices.

An adhesion structure and an electronic device are provided. The adhesion structure includes a substrate and an adhesive layer. The adhesive layer is disposed on the substrate, and the adhesive layer includes a plurality of graphene microplates. A part of the graphene microplates protrude from two opposite surfaces of the adhesive layer. The thickness of the graphene microplates is greater than or equal to 0.3 nanometers and is less than or equal to 3 nanometers. The flake diameter of the graphene microplates is greater than or equal to 1 micrometer and is less than or equal to 30 micrometers. The adhesion structure can not only provide the adhesive function, but also improve the heat dissipation efficiency of electronic device.

The power controller apparatus includes a plurality of parts including a heat member and a heat dissipation member. The power controller apparatus includes a housing for accommodating these plurality of parts. The power controller apparatus includes a snap fit and a thermal conductive member. The snap fit connects the heat member and the heat dissipation member. The thermal conductive member is arranged between the heat member and the heat dissipation member. The thermal conductive member includes a filler having anisotropy with respect to thermal conductivity. The filler is oriented so as to exhibit high thermal conductivity in a stacking direction between the heat member and the heat dissipation member.

The present invention relates to a composite material and a heat dissipation part composed of the composite material, wherein particles composed of a material having excellent thermal conductivity properties, such as diamond or silicon carbide (SiC), are composited in a metal matrix to implement excellent thermal conductivity, and at the same time, to control a thermal expansion coefficient to be in a desired range, and particularly, even if high heat is applied, the thermal conductivity is hardly degraded.

This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

A thermal interface material delivered as a single-component precursor mixture which reacts to form a soft, solid material. Thermally conductive particles are dispersed in the reactive polymer matrix resulting in a composite material with high thermal conductivity. A reaction inhibitor is provided so that the one-component system is stable in storage and handling at room temperature, and curable at an elevated temperature. The uncured precursor material is easily dispensed using conventional single-component automated pumping equipment, and subsequently cured in place.

Various examples are provided for high voltage isolation. The isolation can be provided for discrete non-isolated devices using an electrically isolating substrate that is thermally conductive. In one example, a module includes a plurality of switching devices connected in series; one or more rubber buffer disposed between switching device pairs of the plurality of switching devices; and thermal interfaces disposed between switching devices of the switching device pairs and cooling surfaces of the module, the thermal interfaces electrically isolating the switching devices from the cooling surface. In another example, an extreme fast charger (EFC) station includes an active front end (AFE) module that includes at least one module, where the module is a half-bridge power module. The EFC station can include a dual-active-bridge (DAB) high voltage (HV) module that includes at least one module, where the module is a half-bridge power module.

An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.

A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.

Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.