According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

A thermal conducting sheet having a high adhesion between layers even if the thermal conducting sheet has a multilayer structure is provided. The thermal conducting sheet including a low-hardness layer and a reinforcing layer laminated on one side or both sides of the low-hardness layer. The reinforcing layer having a hardness greater than a hardness of the low-hardness layer. The low-hardness layer comprises: acrylic polymer, silicon carbide, aluminum hydroxide, magnesium hydroxide, and plasticizer.

An electronic device comprises a first case, a resin plate, and a display. The first case has a first surface and a second surface. The resin plate is located inside the first case. The display is located on a side facing the first surface of the first case.

The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

A thermally conductive sheet precursor according to an embodiment of the present disclosure includes agglomerates in which anisotropic thermally conductive primary particles are agglomerated, an isotropic thermally conductive material different from the agglomerates and having an average particle diameter of about 20 μm or greater, and a binder resin. When a first pressure in a range from about 0.75 to about 12 MPa is applied to the thermally conductive sheet precursor, at least some the agglomerates disintegrate.

A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.

Provided are a communication system and a communication apparatus thereof, the communication apparatus includes: a bottom case and a printed circuit board mounted on the bottom case, the communication apparatus further includes a heat-conductive mounting strip, the printed circuit board being mounted on the bottom case by means of the heat-conductive mounting strip, wherein a lower end surface of the heat-conductive mounting strip is connected to the bottom case, and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board.

A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1>Ra2≥Ra3 is satisfied.

Provided are a heat radiation member and a mobile terminal having the same, in which the heat radiation member includes: a heat radiation sheet configured to disperse and radiate transferred heat and block and insulate transferred heat; and a passage formed in the heat radiation sheet and configured to pass a communication radio signal, wherein the passage comprises at least one punching area penetrating the heat radiation sheet.