An electronic apparatus includes a first chassis, a second chassis, a hinge device having a movable portion applied with a lubricant and connecting the first chassis and the second chassis relatively rotatably, a spine part made of a thermal conductive material, a first thermal conductive member which is provided on an inner surface of the first chassis and contacts the spine part at a position not to overlap with the movable portion at a second posture, and a second thermal conductive member which is provided on an inner surface of the second chassis and contacts the spine part at a position not to overlap with the movable portion at the second posture.

Disclosed is a method for producing a thermally conductive thin film for protecting elements and the like integrated inside an electronic device such as a smartphone from heat. A method for using synthetic graphite powder to produce a thin film that has excellent thermal conductivity compared to existing natural graphite thin films or metal thin films and can be produced at lower cost than existing synthetic graphite thin films obtained from polyimide or the like may be provided.

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

The present invention provides an anisotropic, thermal conductive, electromagnetic interference (EMI) shielding composite including a plurality of aligned polymer nanofibers to form a polymer mat or scaffold having a first and second planes of orientation of the polymer nanofibers. The first plane of orientation of the polymer nanofibers has a thermal conductivity substantially the same as or similar to that of the second plane, and the thermal conductivity of the first or second plane of orientation of the polymer nanofibers is at least 2-fold of that of a third plane of orientation of the polymer nanofibers which is about 90 degrees out of the first and second planes of orientation of the polymer nanofibers, respectively, while the electrical resistance of each of the first and second planes is at least 3 orders lower than that of the third plane. A method for preparing the present composite is also provided.

Provided is a composite thermal insulation sheet including an aerogel and a method for manufacturing the same. The methods yield an ultra-thin aerogel composite sheet having characteristics of low dust, high strength and high thermal insulation, thereby having an increased applicability thereof to an electronic device.

A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.

A heat dissipation system for an antenna assembly for a vehicle is disclosed that provides enhanced heat removal attributes and that provides heat transfer from various components to a heat sink through different heat transfer flow paths to reduce the transfer of heat from high heat producing components to heat sensitive components. Improved heat insulation components can be added to maximize the thermal isolation between heat producing components and to prevent heat transferred from the vehicle into the antenna assembly.

One embodiment of the present invention relates to a thermally conductive sheet containing graphite particles (A) including at least one selected from the group consisting of flake-like particles, ellipsoidal particles, and cylindrical particles, in which the graphite particles (A) are oriented in a thickness direction, and a thickness compression ratio is 24% or more at a temperature of 150° C. and a compressive stress of 0.14 MPa.

Provided are a heat dissipation structure for a display panel, and a manufacturing method and an application thereof. The heat dissipation structure includes a copper foil layer and a heat conducting layer disposed on the copper foil layer; wherein a material of the heat conducting layer includes a heat conducting material having a three-dimensional structure, and a gap in the three-dimensional structure of the heat conducting material is filled with a buffer.