Provided are a liner and a display device including the same. The liner includes a first liner including a first shield can protection portion, a first grip portion, and a connection portion coupling the first shield can protection portion to the first grip portion, a second liner including a second shield can protection portion and a second grip portion, and a perforated line formed along a boundary between the first liner and the second shield can protection portion.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

An electronic apparatus includes a conductive member and a printed circuit board, wherein the printed circuit board includes a printed wiring board having a signal wiring formed thereon, a first semiconductor device configured to output a digital signal to the signal wiring, and a second semiconductor device configured to input the digital signal output from the first semiconductor device via the signal wiring, wherein the signal wiring has a signal wiring pattern formed on a surficial layer located opposite the conductive member in the printed wiring board, and wherein the conductive member has an aperture formed therein and located opposite the signal wiring pattern or includes a flat plate portion and a recessed portion recessed in a direction more away from the printed wiring board than the flat plate portion.

A circuit board for a control device for a vehicle includes a clamp edge for clamping on a cover for covering circuit board, the clamp edge being formed by an electrically conductive layer that is situated on an upper side of the circuit board. The circuit board has a plurality of solder bumps for shielding an electromagnetic radiation, the solder bumps being arranged in a row in clamp edge, and each of solder bumps being insulated from the electrically conductive layer by a ring of solder resist.

A receiving device includes a shield case which is in a hollow box shape that is open on one side. The shield case reduces external interfering signals which interfere with an input signal of a broadcast wave. A printed wiring board includes a conductive portion that is electrically connected with an electronic component. A soldered portion is formed along a protrusion-free linearly extending side of an opening edge of the shield case. The soldered portion electrically connects with solder the shield case and the conductive portion.

Provided is an electric driving device including a plate member which is made of a material having electroconductivity, and is arranged between a cover and a control unit main body. An electroconductive member made of a material having electroconductivity is provided to the cover. The plate member includes a first mounting portion and a second mounting portion. The first mounting portion is mounted to a control unit main body, and a second mounting portion is formed at a position different from a position of the first mounting portion. The electroconductive member has a connection portion which projects from the cover. At least one of the second mounting portion or the connection portion is more deformable than the plate member except for the second mounting portion.

Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.