An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.

An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.

In an example there is provided a method for electro-magnetically shielding a circuit board assembly. The method comprises depositing a solder material at multiple locations on a substrate, heating the solder material according to a predetermined thermal profile and coupling an enclosure to the substrate at the locations to provide an electromagnetic shielding for components attached to the substrate. The locations are arranged on the substrate such that a size of a largest aperture of the circuit board assembly is below a pre-determined threshold size value.

A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.

An electronic device and shield can structure are provided. The electronic device includes a housing, a circuit board disposed in the housing and one or more electronic components mounted on the circuit board, a shield can coupled to the circuit board and covering the one or more electronic components, one or more first fastening structures disposed on the circuit board and coupled to the shield can, the one or more first fastening structures having a first width, and one or more second fastening structures extending from the one or more first fastening structures, the one or more second fastening structures having a second width smaller than the first width.

The present invention provides a contact capable of suppressing an increase in a DC resistance value for a long period and a method of manufacturing the same. The contact includes a base portion and an elastic contact portion. The elastic contact portion includes a planar portion configured in a planar shape; and a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface. The elastic contact portion is configured to come into pressed contact with the second surface at the projection portion. The projection portion is configured such that a dimensional ratio H/L of the height H to the length L satisfies 0.25H/L0.44, where H is a height in a direction perpendicular to the one surface and L is a length in a direction parallel to the one surface.

An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component. The conductive shield can structure may include: a first conductive plate including a first edge portion, a second edge portion spaced apart from the first edge portion, and a third edge portion extending between the first and second edge portions, and in top view of the one face of the printed circuit board, including a first flat portion parallel to the printed circuit board and constructing a recess together with the first to third edge portions; a second conductive plate including a fourth edge portion extending substantially parallel to the third edge portion, and in top view of the one face of the printed circuit board, including a second flat portion to be attached to the first flat part while at least partially overlapping the first flat portion; a first side portion extending along the first edge portion and substantially vertical to the first flat portion; a second side portion extending along the second edge portion and substantially vertical to the first flat portion; and a third side portion bent from the fourth edge portion while surrounding the third edge portion, and substantially vertical to the first flat portion.

Provided is an electrically conductive solderable gasket configured to be not easily separated or detached from a circuit board by external force after the electrically conductive solderable gasket is mounted on the circuit board by soldering. The gasket includes: a single-body metallic support and an elastic electrical contact terminal which is superposed on an upper portion of the support and into which portions of the support are fitted, wherein the support includes a fixing portion, extensions bent upward from both lengthwise ends of the fixing portion, and first and second fitting portions bent inward respectively from upper ends of the extensions, wherein the first and second fitting portions are fitted into a through-hole of the electrical contact terminal and overlap each other in a state in which a lower surface of a metal layer of the electrical contact terminal is placed in contact with the fixing portion.

An electronic apparatus includes a conductive member and a printed circuit board, wherein the printed circuit board includes a printed wiring board having a signal wiring formed thereon, a first semiconductor device configured to output a digital signal to the signal wiring, and a second semiconductor device configured to input the digital signal output from the first semiconductor device via the signal wiring, wherein the signal wiring has a signal wiring pattern formed on a surficial layer located opposite the conductive member in the printed wiring board, and wherein the conductive member has an aperture formed therein and located opposite the signal wiring pattern or includes a flat plate portion and a recessed portion recessed in a direction more away from the printed wiring board than the flat plate portion.

Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.