Patent classifications
H05K9/0035
Element, system and method for retaining a component to a surface
The invention relates to a system for retaining a component to a surface which includes a surface; a component; and at least two elements. Each element has a base connected to the surface, the at least two elements provide means for retaining the component to the surface, wherein a first means is biased to a first position in which the first means extend beyond an edge of a first base such that when the component is placed on the surface the first means are configured to move to a second position in order to retain the component in its position relative to the surface. The component provides at least one cavity defined by at least two inner faces, and wherein upon placement of the component on the surface, the base of each element is situated solely within the at least one cavity of the component.
Device faraday cage
The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.
ELEMENT, SYSTEM AND METHOD FOR RETAINING A COMPONENT TO A SURFACE
The invention relates to a system for retaining a component to a surface which includes a surface; a component; and at least two elements. Each element has a base connected to the surface, the at least two elements provide means for retaining the component to the surface, wherein a first means is biased to a first position in which the first means extend beyond an edge of a first base such that when the component is placed on the surface the first means are configured to move to a second position in order to retain the component in its position relative to the surface. The component provides at least one cavity defined by at least two inner faces, and wherein upon placement of the component on the surface, the base of each element is situated solely within the at least one cavity of the component.
Eyewear with RF shielding having grounding springs
A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.
Shield Can as Stiffener on Flexible Printed Circuits
Aspects of the present disclosure are directed to a flexible printed circuit board (FPC) assembly including an FPC, an electrical connector mounted on a first surface of the FPC and configured to transfer data and power signals, and a shield can mounted on a second surface of the FPC. The electrical connector can be a USB-C connector. The second surface of the FPC can be opposite the first surface of the FPC. The shield can can surround an area on the second surface of the FPC that overlaps an area of the first surface of the FPC on which the electrical connector is mounted. Electromagnetic discharge (ESD) protection components can be mounted on the FPC within the shield can. The shield can can be configured as a strain-relief to stiffen the FPC, and can electromagnetically shield the ESD protection components.
Soft and/or flexible EMI shields and related methods
According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
Clip and fixing mechanism
A clip is provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes spring pieces including a first and second spring pieces connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first and second spring pieces when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially in a position farther away from the base portion than the second portion of at least one of the first or second spring pieces. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.
Electronic component mounting device
An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.
Clip and Fixing Mechanism
A clip is provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes spring pieces including a first and second spring pieces connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first and second spring pieces when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially in a position farther away from the base portion than the second portion of at least one of the first or second spring pieces. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.
Electronic assembly having a conductive shield and grounding contacts
Electronic assembly includes a printed circuit having a plurality of thru-holes. The electronic assembly also includes a conductive shield having a plurality of sidewalls. The sidewalls define a cavity. Edges of at least some of the sidewalls interface with the printed circuit along a perimeter line. The perimeter line intersects the thru-holes or extends immediately adjacent to the thru-holes. The electronic assembly also includes a plurality of grounding contacts that are each discrete with respect to the conductive shield. Each of the grounding contacts of said plurality includes a pin segment and a wall-engaging segment. The pin segments include compliant pins that are insertable into the thru-holes. The wall-engaging segments are connected to respective sidewalls. The grounding contacts are distributed along the perimeter line and electrically couple the conductive shield to the ground conductor of the printed circuit.