H01L21/02398

Epitaxial growth using atmospheric plasma preparation steps
09909232 · 2018-03-06 · ·

After CMP and before an epitaxial growth step, the substrate is prepared by an atmospheric plasma which includes not only a reducing chemistry, but also metastable states of a chemically inert carrier gas. This removes residues, oxides, and/or contaminants. Optionally, nitrogen passivation is also performed under atmospheric conditions, to passivate the substrate surface for later epitaxial growth.

Optimized heteroepitaxial growth of semiconductors

A method of performing HVPE heteroepitaxy comprises exposing a substrate to a carrier gas, a first precursor gas, a Group II/III element, and ternary-forming gasses (V/VI group precursor), to form a heteroepitaxial growth of a binary, ternary, and/or quaternary compound on the substrate; wherein the carrier gas is H.sub.2, wherein the first precursor gas is HCl, the Group II/III element comprises at least one of Zn, Cd, Hg, Al, Ga, and In; and wherein the ternary-forming gasses comprise at least two or more of AsH.sub.3 (arsine), PH.sub.3 (phosphine), H.sub.2Se (hydrogen selenide), H.sub.2Te (hydrogen telluride), SbH.sub.3 (hydrogen antimonide, or antimony tri-hydride, or stibine), H.sub.2S (hydrogen sulfide), NH.sub.3 (ammonia), and HF (hydrogen fluoride); flowing the carrier gas over the Group II/III element; exposing the substrate to the ternary-forming gasses in a predetermined ratio of first ternary-forming gas to second ternary-forming gas (1tf:2tf ratio); and changing the 1tf:2tf ratio over time.

METHOD OF FABRICATING A DEVICE HAVING A PASSIVATING LAYER

In one example of the disclosed technology, a method of fabricating a device comprises forming a patterned layer of a material on a surface of a substrate by depositing the material through a stencil mask, and forming a passivating layer over the patterned layer and the substrate surface in a sealed apparatus, the substrate being maintained under a vacuum until after the passivating layer has been formed. In some examples, the passivation is performed by oxidising a deposited aluminium layer within a deposition chamber. In some examples, the method can be used for fabricating hybrid semiconductor-superconductor devices, such as Majorana zero mode (MZM) nanowire structures for topological quantum bits.

Semiconductor element and method for producing the same

A method for producing a semiconductor element includes a step of forming a multiple quantum well in which a GaSb layer and an InAs layer are alternately stacked on a GaSb substrate by MOVPE, wherein, in the step of forming a multiple quantum well, an InSb film is formed on at least one of a lower-surface side and an upper-surface side of the InAs layer so as to be in contact with the InAs layer.

Epitaxial Growth Using Atmospheric Plasma Preparation Steps
20170051431 · 2017-02-23 · ·

After CMP and before an epitaxial growth step, the substrate is prepared by an atmospheric plasma which includes not only a reducing chemistry, but also metastable states of a chemically inert carrier gas. This removes residues, oxides, and/or contaminants. Optionally, nitrogen passivation is also performed under atmospheric conditions, to passivate the substrate surface for later epitaxial growth.