Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/02
Manufacture or treatment of semiconductor devices or of parts thereof
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H01L21/04
the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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H01L21/50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07; e.g. sealing of a cap to a base of a container
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H01L21/60
Attaching; or detaching; leads or other conductive members, to be used for carrying current to or from the device in operation
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H01L2021/60007
involving a soldering or an alloying process
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H01L2021/60022
using bump connectors, e.g. for flip chip mounting
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H01L2021/6006
with temporary supporting member not part of an apparatus, e.g. removable coating, film or substrate
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H01L2021/6006

Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrier
12463192 · 2025-11-04 · ·

A method of forming an integrated circuit package includes: attaching a first carrier to a package component, the package component including: an interposer; a first semiconductor die attached to a first side of the interposer; a second semiconductor die attached to the first side of the interposer; an encapsulant encapsulating the first semiconductor die and the second semiconductor die; and conductive connectors attached to a second side of the interposer; attaching a second carrier to a package substrate, the package substrate including bond pads; bonding the conductive connectors of the package component to the bond pads of the package substrate by reflowing the conductive connectors while the first carrier is attached to the package component and while the second carrier is attached to the package substrate; removing the first carrier; and removing the second carrier.

TUNABLE LOW-COST PASSIVATION COATING FOR FACILITATING FLUXLESS BONDING OF COPPER SOLDER INTERCONNECTS IN FLIP CHIP ASSEMBLY
20250364276 · 2025-11-27 ·

The invention provides improved techniques for bonding copper to solder or other types of flip chip devices using a passivation coating on copper. The surface of a substrate is cleaned prior to mounting a flip chip device onto the substrate. The substrate is rinsed to remove residual artifacts remaining on the surface subsequent to the cleaning. Subsequent to the rinsing, a protective coating is applied to the surface of the substrate to produce a coated substrate. Copper pillars with solder caps extending from the flip chip device are bonded to metallic features on the surface of the coated substrate.

METHOD OF FORMING INTEGRATED CIRCUIT PACKAGES BY BONDING PACKAGE COMPONENT HAVING FIRST CARRIER TO PACKAGE SUBSTRATE HAVING SECOND CARRIER
20250364521 · 2025-11-27 ·

A method of forming an integrated circuit package includes: attaching a first carrier to a package component, the package component including: an interposer; a first semiconductor die attached to a first side of the interposer; a second semiconductor die attached to the first side of the interposer; an encapsulant encapsulating the first semiconductor die and the second semiconductor die; and conductive connectors attached to a second side of the interposer; attaching a second carrier to a package substrate, the package substrate including bond pads; bonding the conductive connectors of the package component to the bond pads of the package substrate by reflowing the conductive connectors while the first carrier is attached to the package component and while the second carrier is attached to the package substrate; removing the first carrier; and removing the second carrier.