According to one embodiment, a semiconductor device includes an insulating substrate, a first metal layer on the insulating substrate, a first insulating layer on the insulating substrate and the first metal layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer and the first insulating layer, a second metal layer on the second insulating layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer. The first metal layer overlaps the second metal layer. A third metal layer contacts a top surface of the second metal layer and a top surface of the first metal layer.

[Problem to be Solved] To provide a transistor and an electronic device whose characteristics are easier to control. [Solution] A transistor including: a semiconductor substrate; an insulating layer provided on the semiconductor substrate; a semiconductor layer provided on the insulating layer in a protruding manner; and a gate electrode provided over a portion of the insulating layer on the semiconductor layer and the insulating layer. A middle portion of a channel region of the semiconductor layer covered by the gate electrode is provided in a shape different from a shape of at least one of ends of the channel region of the semiconductor layer.

Provided is a thin film transistor, including: a base that includes, on an upper surface, a first region and a second region; a gate electrode that is provided on the first region of the base; a gate insulating film that is provided on a surface of the gate electrode and the second region of the base; and a semiconductor layer that is provided on a surface of the gate insulating film, wherein the semiconductor layer includes a third region and a fourth region, in the third region, the semiconductor layer and the gate electrode face with a minimum interval, in the fourth region, a distance from the semiconductor layer to the gate electrode is larger than the minimum interval, and at a boundary position between the third region and the fourth region, the semiconductor layer forms a linear shape or a substantially linear shape.

According to one embodiment, a display device includes a display panel and a drive circuit. A transistor provided in a pixel portion or a peripheral portion of the display panel includes a semiconductor layer having a first end and a second end, first and second gate electrodes overlapping the semiconductor layer, a source electrode connected to the first end, and a drain electrode connected to the second end. The first and second gate electrodes are disposed in a first layer. The source electrode and the drain electrode are disposed in a second layer. The source electrode is formed to cover at least a first channel region in planar view. The drain electrode is formed to cover at least a second channel region in planar view.

A self-healing field-effect transistor (FET) device is disclosed in this application, the self-healing FET has a self-healing substrate, a self-healing dielectric layer, a gate electrode, at least one source electrode, at least one drain electrode, and at least one channel. The self-healing substrate and the self-healing dielectric layer have a disulfide-containing poly(urea-urethane) (PUU) polymer. The self-healing dielectric layer has a thickness of less than about 10 .Math.m. The electrodes have electrically conductive elongated nanostructures. The at least one channel has semi-conducting elongated nanostructures.

A display panel according to one embodiment of the present disclosure includes a substrate, an active electrode over the substrate and including a source region, a drain region, and a channel region, and an active upper electrode of a curved shape over the active electrode. The channel region of the active electrode and the active upper electrode may overlap each other and the channel region may have a same shape as the active upper electrode. Accordingly, a driving element included in the display panel may generate a high driving current and the degree of integration in a pixel may be improved.

A semiconductor device is manufactured using a transistor in which an oxide semiconductor is included in a channel region and variation in electric characteristics due to a short-channel effect is less likely to be caused. The semiconductor device includes an oxide semiconductor film having a pair of oxynitride semiconductor regions including nitrogen and an oxide semiconductor region sandwiched between the pair of oxynitride semiconductor regions, a gate insulating film, and a gate electrode provided over the oxide semiconductor region with the gate insulating film positioned therebetween. Here, the pair of oxynitride semiconductor regions serves as a source region and a drain region of the transistor, and the oxide semiconductor region serves as the channel region of the transistor.

A method includes forming a gate structure over a silicon on insulator (SOI) substrate. The SOI substrate comprising: a base semiconductor layer; an insulator layer over the base semiconductor layer; and a top semiconductor layer over the insulator layer. The method further includes depositing a gate spacer layer over a top surface and along a sidewall of the gate structure; etching the gate spacer layer to define a gate spacer on the sidewall of the gate structure; after etching the gate spacer layer, etching a recess into the top semiconductor layer using a first etch process; and after the first etch process, extending the recess further into the top semiconductor layer using a second etch process. The first etch process is different from the second etch process. The method further includes forming a source/drain region in the recess after the second etch process.

A III-N-based vertical transistor includes a III-N substrate, a source, a drain, and a channel comprising a III-N crystal material and extending between the source and the drain. The channel includes at least one sidewall surface aligned ±0.3° with respect to an m-plane of the III-N crystal material. The III-N-based vertical transistor also includes a gate electrically coupled to the at least one sidewall surface of the channel.

A thin film transistor, a thin film transistor substrate including the thin film transistor and a display device are provided. The thin film transistor includes a first active layer, a first auxiliary gate electrode and a first gate electrode, wherein the first active layer includes a first channel portion, a first connection portion that is in contact with one side of the first channel portion, and a second connection portion that is in contact with the other side of the first channel portion.