Various aspects of the present invention provide an apparatus and a method of removing an orthopedic implant from a patient. In one embodiment, the method includes cycling the temperature of at least a portion of the orthopedic implant between a first temperature and a second temperature that differs from the first temperature. In one embodiment, the first temperature is above 0 C. and the second temperature is below 0 C. The temperature cycling causes a thermal expansion differential between at least a portion of the orthopedic implant and material in a region contacting the orthopedic implant. In one embodiment, the thermal expansion differential is of an extent sufficient to cause physical separation of at least a portion of the surface of the orthopedic implant from material contacting the surface of the orthopedic implant.

Disclosed herein are systems and methods for intervertebral body fusion that provide more robust support within the disc space. Intervertebral body fusion devices can have a unitary monolithic body including a plurality of body segments interconnected with each other by flexure members. Devices can be configured to be inserted through an opening in a compressed configuration and then expanded within the disc space to an expanded configuration. In the expanded configuration, devices can have a greater mediolateral or transverse to the disc space footprint. This wider footprint provides greater support for the vertebrae relative to the size of the opening through which the device is inserted. Changes between the expansion and compression configurations can be controlled based on the temperature of the device.

A medical system and method can used to treat a bone. The system and method can include the preparation of bone cement to be used in the treatment. A non-liquid component and a liquid component can be combined to form a bone cement. A vacuum system can be used to saturate the non-liquid component with the liquid component. The bone cement and/or components can be heated and/or cooled.