Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

A laser assisted bonding method comprises placing a semiconductor die on a substrate, wherein the semiconductor die has on its back surface solder bumps and on its front surface an anti-reflection layer for infrared laser; and irradiating an infrared laser beam to the semiconductor die through the anti-reflection layer, to reflow the solder bumps between the semiconductor die and the substrate via heat generated due to energy of the infrared laser beam absorbed by the semiconductor die, wherein the anti-reflection layer is configured to reduce reflection of the infrared laser beam from the semiconductor die.

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Disclosed is an exposed bonding pad of a chip package and a manufacturing method thereof. The manufacturing method comprises: before the package body is cut, forming a protruding bonding pad on the package body to replace a step of synchronously forming solder pins while forming a conductive layer group in the package body. Cutting grooves is each arranged at a position of a corresponding scribe line to be cut and is each symmetric about the corresponding scribe line. An L-shaped protruding bonding pad wrapping a right-angled edge of the package body is provided is formed inside a corresponding cutting groove instead of an original plate-shaped bonding pad, and process sequence for forming the bonding pad is changed, so that the processing is convenient, tin wicking growth can be obviously observed when soldering the package body, which is convenient for observation and avoids void soldering.