A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.

Resin covers a side surface and a back surface of a blue LED and holds the blue LED level. An electrode is disposed between a top surface of a wiring substrate and a back surface of the blue LED, extends through the resin, and electrically connects the wiring substrate and the blue LED to each other. A light-outgoing surface (top-surface) of the blue LED is exposed without being covered with the resin, and the light-outgoing surface (top-surface) is flush with a top surface of the resin.

Resin covers a side surface and a back surface of a blue LED and holds the blue LED level. An electrode is disposed between a top surface of a wiring substrate and a back surface of the blue LED, extends through the resin, and electrically connects the wiring substrate and the blue LED to each other. A light-outgoing surface (top-surface) of the blue LED is exposed without being covered with the resin, and the light-outgoing surface (top-surface) is flush with a top surface of the resin.

A light-emitting device includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from that of the first light-emitting element, a light-guide member covering a light extracting surface and lateral surfaces of the first light-emitting element and a light extracting surface and lateral surfaces of the second light-emitting element, and a wavelength conversion layer continuously covering the light extracting surface of each of the first and second light-emitting elements and disposed apart from each of the first and second light-emitting elements, and a first reflective member covering outer lateral surfaces of the light-guide member. An angle defined by an active layer of the first light-emitting element and an active layer of the second light-emitting element is less than 180 at a wavelength conversion layer side.

A light-emitting device includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from that of the first light-emitting element, a light-guide member covering a light extracting surface and lateral surfaces of the first light-emitting element and a light extracting surface and lateral surfaces of the second light-emitting element, and a wavelength conversion layer continuously covering the light extracting surface of each of the first and second light-emitting elements and disposed apart from each of the first and second light-emitting elements, and a first reflective member covering outer lateral surfaces of the light-guide member. An angle defined by an active layer of the first light-emitting element and an active layer of the second light-emitting element is less than 180 at a wavelength conversion layer side.

Integrated circuit cell architectures including both front-side and back-side structures. One or more of back-side implant, semiconductor deposition, dielectric deposition, metallization, film patterning, and wafer-level layer transfer is integrated with front-side processing. Such double-side processing may entail revealing a back side of structures fabricated from the front-side of a substrate. Host-donor substrate assemblies may be built-up to support and protect front-side structures during back-side processing. Front-side devices, such as FETs, may be modified and/or interconnected during back-side processing. Back-side devices, such as FETs, may be integrated with front-side devices to expand device functionality, improve performance, or increase device density.

Integrated circuit cell architectures including both front-side and back-side structures. One or more of back-side implant, semiconductor deposition, dielectric deposition, metallization, film patterning, and wafer-level layer transfer is integrated with front-side processing. Such double-side processing may entail revealing a back side of structures fabricated from the front-side of a substrate. Host-donor substrate assemblies may be built-up to support and protect front-side structures during back-side processing. Front-side devices, such as FETs, may be modified and/or interconnected during back-side processing. Back-side devices, such as FETs, may be integrated with front-side devices to expand device functionality, improve performance, or increase device density.

First and second contacts are formed on first and second wafers from disparate first and second conductive materials, at least one of which is subject to surface oxidation when exposed to air. A layer of oxide-inhibiting material is disposed over a bonding surface of the first contact and the first and second wafers are positioned relative to one another such that a bonding surface of the second contact is in physical contact with the layer of oxide-inhibiting material. Thereafter, the first and second contacts and the layer of oxide-inhibiting material are heated to a temperature that renders the first and second contacts and the layer of oxide-inhibiting material to liquid phases such that at least the first and second contacts alloy into a eutectic bond.

A light emitting apparatus includes a mount substrate; two or more light emitting devices mounted on the mount substrate such that adjacent light emitting devices face each other at lateral surfaces thereof; a light transparent member positioned on upper surfaces of the light emitting devices, the light transparent member having a plate shape and being positioned to receive incident light emitted from the light emitting devices; and a covering member. In a plan view, the light transparent member is larger than each of the light emitting devices. The covering member contains a light reflective material and covers at least a lateral surface of the light transparent member.

A light emitting apparatus includes a mount substrate; two or more light emitting devices mounted on the mount substrate such that adjacent light emitting devices face each other at lateral surfaces thereof; a light transparent member positioned on upper surfaces of the light emitting devices, the light transparent member having a plate shape and being positioned to receive incident light emitted from the light emitting devices; and a covering member. In a plan view, the light transparent member is larger than each of the light emitting devices. The covering member contains a light reflective material and covers at least a lateral surface of the light transparent member.