Patent classifications
H01F1/14758
Magnetic Powder for High-Frequency Applications and Magnetic Resin Composition Containing Same
There is provided a magnetic powder for high frequency use including, in percent by mass, 0.2 to 5.0% C and at least one selected from Group IV to VI elements, Mn, and Ni in a total of 0.1 to 30%, the balance being Fe or/and Co, inclusive 0% for Co), and incidental impurities, wherein the saturation magnetization exceeds 1.0 T and satisfies Expression (1): Co%/(Co%+Fe%)0.50. According to the magnetic powder, there is provided a metal magnetic powder having a saturation magnetization exceeding 1.0 T and also having a high FR of 200 MHz or more and a magnetic resin composition including the metal magnetic powder.
Method for manufacturing high-density integrally-molded inductor
Provided is a method for manufacturing a high-density integrally-molded inductor, comprising the following steps: (1) winding an enameled wire coil to be spiral; (2) mechanically pressing first ferromagnetic powder into a magnetic core; (3) mounting the magnetic core into a hollow cavity of the enameled wire coil; (4) mounting the enameled wire coil provided with the magnetic core into an injection mold; (5) uniformly mixing and stirring resin glue, a coupling agent and an accelerant, to obtain high-temperature resin glue; (6) uniformly stirring second ferromagnetic powder and the high-temperature resin glue, to obtain a magnetic composite material; (7) injecting the magnetic composite material into a mold cavity of the injection mold for molding, and solidifying the magnetic composite material to obtain an outer magnet; and (8) cooling and de-molding the outer magnet, to obtain a molded inductor.
ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate, and a composite molding member having conductivity that covers the surface of the substrate so as to embed the electronic component and that is connected to the power supply pattern. The composite molding member includes a resin material and a first filler blended in the resin material and containing 32 to 39 wt. % of a metal material composed mainly of Ni in Fe.
MANUFACTURING METHOD OF COIL-EMBEDDED INDUCTOR USING SOFT MAGNETIC MOLDING SOLUTION AND COIL-EMBEDDED INDUCTOR MANUFACTURED BY USING THE SAME
An optimal condition is disclosed in which a composition of a soft magnetic molding solution includes 94 to 98 wt % of a soft magnetic powder and 2 to 6 wt % of an organic vehicle, in order to manufacture a coil-embedded inductor having various advantages such as high inductance, a low core loss, and high reliability. An exemplary manufacturing method is provided of a coil-embedded inductor having a structure in which a part of a coil is embedded in a magnetic core, which includes preparing an organic vehicle, preparing a soft magnetic molding solution having the density of 5.5 to 6.5 g/cc by mix-milling a soft magnetic powder with the organic vehicle, positioning and fixing a part of the coil in the case, and forming the magnetic core by injecting and curing the soft magnetic molding solution into the case.
COMPOSITE MAGNETIC SEALING MATERIAL
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/ C. or less.
Magnetic components and methods of manufacturing the same
Magnetic component assemblies including moldable magnetic materials formed into magnetic bodies, at least one conductive coil, and termination features are disclosed that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers.
Composite magnetic sealing material
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/ C. or less.
PACKAGED MODULE WITH NOVEL COMPOSITE MAGNETIC MOLDING MATERIAL
A packaged module includes an electrically conductive coil and a composite magnetic molding material covering the electrically conductive coil. The composite magnetic molding material includes coated magnetic particles (MB) dispersed in a composite non-magnetic material (MA). The coated magnetic particles (MB) include large sized particles having sizes in median diameters essentially ranging from 33.6 m to 54.8 m.
Electronic component
An element body 4 includes a metal particle dispersion element 15 in which metal particles 12 are dispersed. A surface of the metal particle dispersion element 15 includes an indicator area 10. The indicator area 10 includes a recess 10a having a predetermined depth measured from a reference plane L of the metal particle dispersion element 15. The predetermined depth D1 is deeper than D50 of the metal particles 12 included in the metal particle dispersion element 15.