Patent classifications
A61F2013/15829
Method for making hydroformed expanded spun bonded nonwoven web
A method for hydroforming a spun bonded nonwoven web includes applying a plurality of pressurized liquid jets onto an original unexpanded spun bonded nonwoven web having an original loft while the web passes over a forming structure. A plurality of spun bonded fibers in the original unexpanded spun bonded nonwoven web are reoriented from a closely packed substantially horizontal orientation to a more loosely packed orientation with greater vertical spacing between the fibers to produce a hydroformed expanded spun bonded nonwoven web having a loft of at least about 1.3 times greater than the original loft of the original unexpanded spun bonded nonwoven web, and an air permeability of at least about 1.2 times greater than an original air permeability of the original unexpanded spun bonded nonwoven web. The hydroformed expanded spun bonded nonwoven web has a surface with a plurality of protuberances in a pattern corresponding to the pattern of apertures in the forming structure.
Method of making a hydroformed composite material
A method for hydroforming a composite precursor material includes forming a composite precursor material comprising an original spun bonded nonwoven web and a polymer film layer. The method also includes applying a plurality of pressurized liquid jets onto an outer surface of the original spun bonded nonwoven web while the composite precursor material passes over a forming structure to push and reorient a plurality of spun bonded fibers from a closely packed substantially horizontal orientation to a more loosely packed orientation with greater vertical spacing between the fibers to produce a hydroformed composite material comprising an expanded spun bonded nonwoven layer having a loft of at least about 1.3 times greater than the original loft of the original spun bonded nonwoven web, and an air permeability of at least about 1.2 times greater than an original air permeability of the original unexpanded spun bonded nonwoven web.
Method and apparatus for drying inks printed on heat sensitive absorbent article components
The present disclosure relates to methods and apparatuses for printing and drying inks on substrates. Printing systems may include a metering device positioned between a printing station and a light source. During operation, the printing station deposits ink onto a substrate to define a printed region. And the light source directs infrared light onto the substrate to define an illumination zone. The printed region is advanced from the printing station to the metering device and from the metering device through the illumination zone, wherein the ink is dried with infrared light traveling from the light source, which also heats the substrate and changes the modulus of elasticity of the substrate. In turn, the metering device isolates the printing station from the change in the modulus of elasticity to help reduce phase shifts caused by changes in the modulus of elasticity resulting from heat in the substrate.
HYDRO-FORMED FILM WITH THREE-DIMENSIONAL MICRO-APERTURES
A hydro-formed film includes a polymeric web having a first substantially planar surface and a second substantially planar surface opposite the first substantially planar surface, and a plurality of three-dimensional micro-apertures extending from the first substantially planar surface. The plurality of three-dimensional micro-apertures have a mesh count in a range of about 40 to about 75 apertures per linear inch. The hydro-formed film has a Compression Sensor Point (CSP) count of at least about 80.
Method of manufacturing a diaper with moisture sensors
The present invention discloses a method of manufacturing a diaper that has multiple moisture sensing elements on interior side of its bottom impermeable layer or on any surface of the top permeable layer. The moisture sending elements are made by spraying conductive ink on a moving sheet of either the bottom impermeable layer or the top permeable layer, before other layers of the diaper are attached. Spraying of conductive ink on the moving sheet causes parallel lines of conductive inks to be formed on the layer. The parallel lines of conductive ink run through the entire length of either of the layers and are designed to get connected with a detecting device. When a user urinates inside the diaper, the moisture causes a closed circuit between at least two of the parallel lines of conductive inks. These formations of closed circuits, between parallel lines of conductive inks, are detected by the detecting device. Also, with increasing volume of moisture, the resistance of the closed circuits also tends to decrease. This rate of decrease of resistance is also detected by the detecting device and is used to calculate a volume of moisture present in the diaper. The detecting device then generates a suitable alarm to give an idea about the saturation level of the diaper. The process of manufacturing sensing elements by spraying conductive inks on moving sheet of layer reduces the processing and modification overhead of specially designed conductive ink printers and also does not impact the manufacturing time of a diaper manufacturing assembly line.
Hydro-formed film with three-dimensional micro-apertures
A method of processing a polymeric web includes providing a forming screen configured for supporting and moving with the web in a machine direction. The forming screen has a plurality of elliptical screen openings, each having a major axis perpendicular to the machine direction and a minor axis parallel to the machine direction. The method includes continuously depositing the web onto the forming screen and passing the web and forming screen through a water stream having a pressure level sufficient to cause the web to be forced into the screen openings, thereby forming protrusions extending from the planar surface of the web. Each protrusion has an apex, an opening at the apex, and an elliptical cross-section parallel to the planar surface of the web. The elliptical cross-section has a protrusion axis ratio that may be selected so as to produce a desired protrusion axis ratio.
FLUID ETCHED FOAM
An absorbent foam having a first surface and a second surface is disclosed. The foam has one or more etched voids. The one or more etched voids have an irregular inner surface.
FLUID ETCHED FOAM
A method of etching an absorbent foam. The method includes providing an absorbent foam; providing a fluid etching process having one or more fluid jets, a carrier belt, and a stencil having one or more open apertures, wherein the carrier belt carries an absorbent foam under the one or more fluid jets, wherein the stencil is between the fluid jets and the absorbent foam; expelling a fluid from the fluid jets through the open apertures of the stencil; and etching the absorbent foam to create an etched foam having voids and one or more pieces of voided foam.
Apparatus and methods for transferring and bonding substrates
A substrate assembly is mechanically deformed to form various products. In part, the substrate assembly may advance toward a bonder apparatus. The bonder apparatus rotates about a longitudinal axis and includes a plurality of manifolds. The plurality of manifolds allow for substrate assemblies including different process product pitches to be processed on a single bonder apparatus.
Apparatuses and methods for transferring and bonding substrates
A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may advance toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation. The bonder apparatus may include a plurality of manifolds positioned about the axis of rotation. The substrate assembly may be advanced onto the bonder apparatus such that the substrate assembly is disposed on the plurality of manifolds. Fluid may be passed to the manifolds onto which the leading edge portion and the trailing edge portion of the substrate assembly are disposed. The manifolds may heat the fluid and the heated fluid may be released onto the trailing edge portion and the leading edge portion of the substrate assembly. The heated portion of the substrate assembly may then be bonded forming a seam.