The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer. The method in which support is checked comprises the following steps: electrical excitation of the support by bringing the metal substrate and the electrically conductive layer into electrical contact with a voltage source (33); and photothermal examination of the excited support so as to detect any possible fault (49, 51) located at least partially in the dielectric coating (29) and to provide a photothermal examination result.

Wafer alignment with restricted visual access has been disclosed. In an example, a method of processing a substrate for fabricating a solar cell involves supporting the substrate over a stage. The method involves forming a substantially opaque layer over the substrate. The substantially opaque layer at least partially covers edges of the substrate. The method involves performing fit-up of the substantially opaque layer to the substrate. The method involves illuminating the covered edges of the substrate with light transmitted through the stage, and capturing a first image of the covered edges of the substrate based on the light transmitted through the stage. The method further includes determining a first position of the substrate relative to the stage based on the first image of the covered edges. The substrate may be further processed based on the determined first position of the substrate under the substantially opaque layer.

A solar cell module includes a solar cell string, a first encapsulant, a second encapsulant having a viscoelasticity greater than a viscoelasticity of the first encapsulant, a front-side protective plate, and a back-side protective sheet. The solar cell string includes a plurality of solar cells and a line member which electrically connects the plurality of solar cells. The lengthwise direction of the line member is different from the maximum expansion and contraction direction of the back-side protective sheet.

The present invention relates to a rock anchor foundation structure suitable for a mountain photovoltaic module and a construction method of the rock anchor foundation structure. A technical solution of the present invention is as follows: the rock anchor foundation structure comprises a drill hole drilled in a rock slope, an anchor rod module arranged in the drill hole and a photovoltaic power station module. The photovoltaic power station module is connected with the anchor rod module through a hollow connecting steel pipe; the photovoltaic power station module comprises a bracket welded on the top of the hollow connecting steel pipe, a beam mutually hinged with the top of the bracket and a photovoltaic cell panel arranged at the upper part of the beam. The rock anchor foundation structure of the present invention is suitable for the technical fields of around treatment and foundation engineering design.

The present invention relates to an apparatus for cleaning a surface, in particular at solar collectors or photovoltaic installations. The apparatus has at least one cleaning head that comprises at least one cleaning member. The cleaning member is in particular a brush that can be set into rotation. The apparatus furthermore has a movement device for moving the cleaning head over at least a part of the surface to be cleaned. The movement device has a first movement unit movable in a first direction and a second movement unit. The cleaning head is movable transversely or obliquely to the first movement direction by means of the second movement unit along a guide means that is connected to the first movement unit. A control means that is arranged at the first and/or second movement units makes it possible to automatically move the first movement unit in dependence on a position of the second movement unit.

A division device includes a platform, a withstanding element and a pressure element. The platform has a platform surface. The withstanding element, located on the platform surface, has at least one shrink-top-type withstanding structure protruding from the platform surface and extending along a withstanding line. The shrink-top-type withstanding structure is to withstand the solar cell sheet. The pressure element, located above the platform, has two forcing portions protruding toward the platform. While the solar cell sheet is under dividing, a back surface of the solar cell sheet opposing to the front surface is arranged to face the shrink-top-type withstanding structure by aligning the trench with the withstanding line, and then the two forcing portions are introduced to apply predetermined depression individually onto the two solar cell units, such that the solar cell sheet are divided into the two separate solar cell units.

A method of manufacturing a semiconductor device includes providing a substrate structure. The substrate structure includes a conductive layer and a plurality of nanopillars spaced apart from each other overlying the conductive layer. Each nanopillar includes a first semiconductor layer and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer have different conductivity types. The method also includes forming a graphene layer overlying the plurality of nanopillars. The graphene layer is connected to each of the plurality of nanopillars.

A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

A roof mount assembly mounts a structure to a roof haying a rafter and a substrate supported by the rafter. The roof mount assembly includes a piece of flashing positioned on the substrate. The flashing includes a first surface, a second surface opposite the first surface and an aperture extending through the flashing. A fastener extends through the flashing aperture. A bracket is connected to the flashing via the fastener, and the bracket is sized to support at least one roof mounted structure on the roof. A seal is positioned between the flashing aperture and the fastener. The seal is sized to form a water-tight seal with the aperture to inhibit flow of fluid through the aperture. The seal includes a first portion and a second portion, in which the first portion is positioned to abut the flashing first surface and the second portion is positioned to extend through the aperture.

A photovoltaic junction box comprising a diode module and a circuit board disposed in a box body, and a heat sink mounted on the outer surface of the box body. The diode module is attached to the back side of the heat sink and is electrically connected to cooper conductor. The heat sink is made of aluminum material and a heat-absorbing layer is provided inside the heat sink. The heat-absorbing layer is close to the diode module. The aluminum heat sink provides great thermal conductivity, therefore, can greatly increase the cooling capacity of the junction box. In addition, because metal material for higher temperature resistance is used instead of lower temperature resistance plastic material, the box body would not deform as easy, greatly increase the safety and reliability of the junction box.