A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.

A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Provided are a supply apparatus and a supply method for supplying fluid carbon dioxide that are energy-saving and efficient. The supply apparatus for supplying fluid carbon dioxide includes: a circulation system including a purifying unit that removes impurities and contaminants from the carbon dioxide, a storage unit that includes a condenser for changing gaseous carbon dioxide passed through the purifying unit into liquid carbon dioxide, a supply unit that includes a first pump for supplying the liquid carbon dioxide in the storage unit to a use point, and a return line through which excess carbon dioxide supplied from the supply unit but not used at the use point is returned to the storage unit; and a carbon dioxide introduction unit that introduces carbon dioxide, as a starting material or recovered gas, to the circulation system. The carbon dioxide introduction unit includes a second pump for increasing the pressure of the carbon dioxide and the second pump introduces the carbon dioxide to the circulation system.

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

Method and apparatus for identifying a contaminant on a substrate. Identification of a contaminant removed from a substrate can be useful in identifying and eliminating or reducing the source of the contamination and tailoring the removal method to minimize the potential for substrate damage. The methods and apparatus for identification of the contaminant provide liberation of molecules of the contaminant from the surface of the substrate, accounting for different geometries and substrate materials, sample preparation, and chemical analysis of the contaminant.

The present invention provides a wet treatment apparatus having divided base frames and waterproofing pans, which has an enhanced waterproofing property and can be easily assembled. A wet treatment apparatus 10 is provided with a first base frame 13 and a second base frame 14. In addition, a first waterproofing pan 15 is arranged on a mounting surface 13a of the first base frame 13, and a second waterproofing pan 16 is arranged on a mounting surface 14a of the second base frame 14. A plate-shaped structure 17 having flexibility is provided on an end 15a of the first waterproofing pan 15. The plate-shaped structure 17 is configured to cover a gap between the end 15a of the first waterproofing pan 15 and an end 16a of the second waterproofing pan 16, and can waterproof a space between the end 15a of the first waterproofing pan 15 and the end 16a of the second waterproofing pan 16.

A jet spray nozzle for cleaning a photolithographic mask or semiconductor wafer and method for cleaning the same. The jet spray nozzle in one embodiment includes a water supply inlet, a gas supply inlet, a first row of gas injection nozzles communicating with the gas supply inlet, a mixing cavity defining a jet spray nozzle outlet, and a flow mixing baffle disposed in the cavity. The mixing baffle preferably is configured and arranged to combine gas and water in the jet spray nozzle for delivering a concentrated stream of gas with a cluster of micro water droplets entrained in the gas for removing contaminant particles from the mask. The jet spray nozzle is capable of cleaning photo masks or wafers without the use of chemicals. In one embodiment, the water may be deionized water and the gas may be nitrogen. In another embodiment, the jet spray nozzle further includes a second row of gas injection nozzles spaced above or below the first row of gas injection nozzles that communicate with the gas supply inlet.

A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.