To perform poling treatment in a simple procedure by dry process. A magnetic field poling device includes a first holding part configured to hold a film-to-be-poled (2); a second holding part configured to hold a magnet generating a magnetic field B to the film-to-be-poled (2); and a moving mechanism configured to move the first holding part or the second holding part in a direction perpendicular to the direction of the magnetic field B.

An ultrasonic transducer element package includes a first substrate, a second substrate, a support body, and first and second ultrasonic transducers. The first substrate has first and second openings that are aligned in a first direction. The second substrate has a third and fourth openings that are aligned in the first direction. The support body supports the first and second substrates. The first and second substrates are aligned in a second direction that intersects with the first direction, with a space therebetween. The first and Second ultrasonic transducer elements are configured at the first and second openings respectively.

An ultrasound vibration device is provided with a stacked transducer in which a plurality of piezoelectric single crystal element layers are stacked between two metal blocks. Since each of the two metal blocks and the plurality of piezoelectric single crystal element layers is fusion-bonded relative to a stack direction by bonding metal having a melting point corresponding to half a Curie point of the plurality of piezoelectric single crystal element layers or below, it is possible to use non-lead material, reduce a processing cost and realize inexpensiveness.

Provided is an ultrasonic probe that is capable of easily dissipating heat generated therein using porous carbon allotrope foams. The ultrasonic probe includes: a matching layer; a piezoelectric layer disposed on a bottom surface of the matching layer; and a backing layer disposed on a bottom surface of the piezoelectric layer and formed of porous carbon allotrope foams and backing materials.

An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.

A method of fabricating a bonded wafer with low carrier lifetime in silicon comprises providing a silicon substrate having opposing top and bottom surfaces, modifying a top portion of the silicon substrate to reduce carrier lifetime in the top portion relative to the carrier lifetime in portions of the silicon substrate other than the top portion, bonding a piezoelectric layer having opposing top and bottom surfaces separated by a distance T over the top surface of the silicon substrate, and providing a pair of electrodes having fingers that are inter-digitally dispersed on a top surface of the piezoelectric layer, the electrodes comprising a portion of a Surface Acoustic Wave (SAW) device. The modifying and bonding steps may be performed in any order. The modified top portion of the silicon substrate prevents the creation of a parasitic conductance within that portion during operation of the SAW device.

A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.

A vibration type actuator providing a satisfactory actuator performance even when an increase in speed is achieved and having a contact spring. The actuator includes a vibrator equipped with an electrical-mechanical energy conversion element, an elastic member to which the electrical-mechanical energy conversion element is fixed, and a protrusion provided on the elastic member. The vibrator can generate an elliptic movement in the protrusion. A driven body is configured to come into contact with the protrusion and to make a relative movement with respect to the vibrator. The protrusion includes a contact portion having a contact surface contacting the driven body, a continuous side wall portion protruding with respect to one end surface of the elastic member and forming a hollow structure, and a connection portion connecting the contact portion and the side wall portion and exhibiting flexibility in a direction normal to the contact surface.

A method for forming piezoelectric transducers for inkjet printheads includes: forming at least one piezoelectric layer on a substrate; forming at least one electrode pattern by depositing a conductive material on an exposed surface of the at least one piezoelectric layer; and forming a plurality of individual piezoelectric elements from the at least one piezoelectric layer before or after the forming of the at least one electrode pattern.