Capacitors, apparatus including a capacitor, and methods for forming a capacitor are provided. One such capacitor may include a first conductor a second conductor above the first conductor, and a dielectric between the first conductor and the second conductor. The dielectric does not cover a portion of the first conductor; and the second conductor does not cover the portion of the first conductor not covered by the dielectric.

A method for manufacturing an electronic component including a step of providing an outer electrode that includes a step of providing a sintered layer containing a sintered metal, a step of providing an insulation layer containing an electric insulation material, and a step of providing a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof. The insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

In a method for manufacturing an electronic component, a step of providing an outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing a reinforcement layer not containing Sn but including Cu or Ni, a step of providing an insulation layer, and a step of providing a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover Bich. The reinforcement layer covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

An energy storage device can include a cathode, an anode, and a separator between the cathode and the anode, where the anode comprises a first lithium ion intercalating carbon component and a second lithium ion intercalating carbon component. The first lithium ion intercalating carbon component can include hard carbon, and the second lithium ion intercalating component can include graphite or soft carbon. A ratio of the hard carbon to the graphite or of the hard carbon to the soft carbon can be between 1:19 to 19:1. The anode may comprise a first lithium ion intercalating carbon component, a second lithium ion intercalating carbon component and a third lithium ion intercalating carbon component. The first lithium ion intercalating carbon component can include hard carbon, the second lithium ion intercalating carbon component can include soft carbon, and the third lithium ion intercalating carbon component can include graphite.

A sintered body that includes semiconductor ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

A capacitor unit and a manufacturing method thereof, which mainly include a substrate, an isolation layer formed on the substrate, and capacitor stacked structures located on the isolation layer to form a capacitor integrated structure including the capacitor units, are provided. Therefore, the capacitor integrated structure can be cut to form a plurality of the capacitor units that can function as capacitors, thereby simplifying the capacitor manufacturing process and reducing the manufacturing cost.

An improved process for forming an electrolytic capacitor is provided. The process comprises: providing an anode with an anode wire extending from the anode body; forming a dielectric on the anode to form an anodized anode; applying a first slurry wherein the first slurry comprises conducting polymer and polyanion, wherein the polyanion and conducting polymer are in a first weight ratio thereby forming a first slurry layer; and applying a second slurry on the first slurry layer wherein the second slurry comprises the conducting polymer and said polyanion and wherein the polyanion and the conducting polymer are in a second weight ratio wherein the second weight ratio is lower than the first weight ratio.

A method for producing an electronic component including a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.

A multilayer component is disclosed. In an embodiment, a multilayer component includes a fully active stack comprising a plurality of dielectric layers, internal electrodes and two external electrodes arranged on opposite sides of the stack, wherein at least one portion of the internal electrode layers are coated.