Patent classifications
Y10T29/43
High precision capacitors
High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.
Single-layer touch-sensitive display
A touch sensor panel having co-planar single-layer touch sensors fabricated on a single side of a substrate is disclosed. The drive and sense lines can be fabricated as column-like patterns in a first orientation and patches in a second orientation, where each column-like pattern in the first orientation is connected to a separate metal trace in the border area of the touch sensor panel, and all patches in each of multiple rows in the second orientation are connected together using a separate metal trace in the border area of the touch sensor panel. The metal traces in the border areas can be formed on the same side of the substrate as the patches and columns, but separated from the patches and column-like patterns by a dielectric layer.
Multilayer Component
A multilayer component is disclosed. In an embodiment, a multilayer component includes a fully active stack comprising a plurality of dielectric layers, internal electrodes and two external electrodes arranged on opposite sides of the stack, wherein at least one portion of the internal electrode layers are coated.
One-sided capacitor foils and methods of making one-sided capacitor foils
A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.
Resonance circuit with a single crystal capacitor dielectric material
A single crystal acoustic electronic device. The device has a substrate having a surface region. The device has a first electrode material coupled to a portion of the substrate and a single crystal capacitor dielectric material having a thickness of greater than 0.4 microns and overlying an exposed portion of the surface region and coupled to the first electrode material. In an example, the single crystal capacitor dielectric material is characterized by a dislocation density of less than 10.sup.12 defects/cm.sup.2. A second electrode material is overlying the single crystal capacitor dielectric material.
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING THE SAME, AND CERAMIC BODY
A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce multi-layer chips each having side surfaces from which the internal electrodes are exposed; smoothing the side surfaces of the multi-layer chips; and providing side margins to the smoothed side surfaces of the multi-layer chips.
Method of manufacturing a capacitor array
An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.
FORMULATIONS FOR AND METHODS OF FABRICATING ENERGY STORAGE DEVICE ELECTRODES
An energy storage device can include a cathode, an anode, and a separator between the cathode and the anode, where the anode comprises a first lithium ion intercalating carbon component and a second lithium ion intercalating carbon component. The first lithium ion intercalating carbon component can include hard carbon, and the second lithium ion intercalating component can include graphite or soft carbon. A ratio of the hard carbon to the graphite or of the hard carbon to the soft carbon can be between 1:19 to 19:1. The anode may comprise a first lithium ion intercalating carbon component, a second lithium ion intercalating carbon component and a third lithium ion intercalating carbon component. The first lithium ion intercalating carbon component can include hard carbon, the second lithium ion intercalating carbon component can include soft carbon, and the third lithium ion intercalating carbon component can include graphite.
Multi-layered ceramic capacitor with soft leaded module
An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
Multilayered Ceramic Capacitor Structures for Use at High Power
An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.