Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

A method for machining a material, in particular steel, is provided. The material is milled at such a high cutting speed that residual tensile stresses close the surface that exceed a specified value can occur and the residual tensile stresses can be lowered below the specified value by subsequent brushing. A device for performing the method is also provided.

Various kinds of finishing and hardening treatments of holes by methods of plastic surface deformation can find application in many branches of engineering industry. In particular for burnishing holes on a milling or drilling machine tool. A device for diamond-burnishing of holes increases the functional possibilities, improves the quality of the treated hole surface and the endurance of the burnishing tool, provides the opportunity for a precise regulation in order to get the necessary hole caliber, and uses the load of all the weights for obtaining the necessary pressing force. The device structure comprises a housing with a tapered stem, central and terminal arms with crossheads and shafts, bars with weights, a foot with a cylindrical body, and an arbor with a diamond-burnishing tool.

A method for chipless machining of a surface region of a rolling-element bearing ring includes rotating the rolling-element bearing ring relative to a first tool having a first tool tip and a second tool having a second tool tip, positioning the first and second tool tips at start positions at first and second opposite axial ends of the surface region, and moving the first and second tools in opposite axial directions such that the first tool tip follows a first helical or spiral path on the surface region and the second tool tip follows a second helical or spiral path on the surface region, the first and second paths crossing at multiple points within an overlap region located between axial ends of the surface regions.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

This invention concerns a burnishing head for smooth rolling of the ring-shaped flat end faces (3, 4) at the thrust bearing of crankshafts by means of two cylindrical burnishing rollers (1, 2) which are arranged to be rotated and are side by side in parallel to each other within a burnishing head housing (12) that is pivotable about its longitudinal axis (20) to reach its the working position. Each burnishing roller (1, 2) is pivoted in a cage (10, 11) which is provided in the burnishing head housing (12) with low play (13) and lateral relocatability.