The present invention relates to the field of railing and fencing systems. More particularly, embodiments of the present invention relate to modular railing/fencing systems comprising extruded aluminum railings with cellular polyvinyl chloride (PVC) panel inserts having an impact resistance of up to about 350 lb/ft.sup.2, which combined provide a system capable of withstanding significant external forces. Particular embodiments of the invention include modular fencing systems comprising: a) one or more upright vertical post members; b) upper and lower horizontal guardrails with a longitudinal panel-receiving channel; c) one or more cellular polyvinyl chloride (PVC) panel inserts operably configured for insertion in the panel-receiving channels of the upper and lower guardrails; d) wherein, upon installation, the system is capable of receiving a load normal to the panel ranging from about 180 to about 360 lb/ft.sup.2 without failure. Cellular PVC panels for use in such systems are also included.

A method punches out a damper from a damper material set on a punching stage with use of a hollow punch so that the punched damper is positioned within a hollow inside of the punch while vibrating a member composing the punching stage on which the damper material is set at the high frequency. The damper material includes a viscoelastic body layer and the constraint layer laminated on the viscoelastic body layer and the viscoelastic body layer includes an attaching surface through which the damper material is detachably attached on the liner.

A cutter for cutting a formed gutter discharged from a seamless gutter machine. The cutter may be positioned to cut a back wall of a formed gutter below a front upper edge of a front wall of the gutter. In turn, a gutter may be mounted to a building (e.g., a fascia board thereof) to achieve additional lift, thereby providing increased pitch over a given length of gutter while maintaining overlap between a gutter apron and a back upper edge of the back wall of the formed gutter.

The disclosure relates to a method for operating a food slicing device in which a food cutting blade is controlled by a sensor, and a device for cutting food. The sensor is used to control the cutting operation of the device. When the sensor senses that the cutting blade is worn, a signal is sent to the apparatus motor to increase cutting force. When the senor detects the consistency and content of the material to be cut, a suitable cutting blade, rotation speed and force can be selected. The sensor can also determine the cutting quality of a cutting blade across its circumference by determining the localized bluntness of the blade edge.

A leak detector includes a sensor assembly including at least one sensor configured to sense acoustic signals; and at least one printed circuit board coupled to the sensor assembly and configured to support a processing device, the processing device comprising at least a microcontroller unit (MCU) and a digital signal processor (DSP), wherein the MCU is configured to continually receive acoustic signals from the sensor assembly, and wherein the DSP is configured to remain in a sleep mode except when the MCU wakes the DSP from the sleep mode at predetermined times.

A saw has a system for sensing the torque on a cutting blade to signal when the blade begins to cut material. The saw has a drive belt extending between a driven wheel and a drive wheel and a belt tensioner that engages a side of the belt and maintains tension in the belt. The belt tensioner is movable to maintain the tension in the belt. A control system calculates the movement of the belt tensioner. The saw has a system for determining the size of the sacrificial blade. A through beam photoelectric emitter and receiver pair are positioned on opposite sides of the blade such that a largest cutting blade is moved above the beam regardless of a horizontal position of the cutting blade and sensor senses a vertical position of the axis of the blade. The sensor senses the vertical position of the blade axis when the blade is moved above the beam.

The present embodiments are directed to apparatus and methods for cutting an object. In one embodiment, the apparatus comprises a cutting device and an actuation device operatively coupled to the cutting device. A guide structure may be coupled at least partially between the cutting device and the actuation device. A supporting framework may provide a guiding path for linear advancement or retraction of the guide structure, and in turn linear advancement or retraction the cutting device, upon actuation of the actuation device.

A contact tip for a sequential test of electronic components comprises a base material and a hard material, wherein the base material and the hard material are fixed to each other and wherein the hard material has a thickness of at least 0.03 mm. The contact tip may be the contact tip of a contact element used for a sequential test of electronic components. A method of producing a contact tip of a contact element used for a sequential test of electronic components, comprises: Providing a plate made up of a base material and a hard material, wherein the base material and the hard material are fixed to each other; Cutting the plate along a cut line to form the contact tip wherein the cut line runs through the base material and the hard material and wherein the hard material has a thickness of at least 0.03 mm in a section where the cut line cuts the hard material.

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 810.sup.3 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23 C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23 C. before thermal curing.

A safety system prevents cutting machine operators from being accidentally carried through the infeed chute into the machine's cutting mechanism. An operator wears a safety device on his wrist and/or ankle and a sensor array mounts on opposing sides of the cutting machine's infeed chute. The sensor array elements are wound in opposite directions and connect in series opposing. The magnetic field of the safety device induces a current in the sensor array as it moves in the proximity of the sensor array. The safety system generates a signal which is proportional to the sum of the induced currents. When the signal exceeds a threshold, the safety system shuts off power to the feed mechanism and/or the cutting blades of the cutting machine, preventing injury to the operator.