Throat plates for table saws and table saws including the same are disclosed. In some embodiments, the throat plates and/or saws include at least one securement mechanism adapted to secure and prevent inadvertent removal of the throat plate from the throat of the saw. In some embodiments, at least one of the securement mechanisms also provides a height adjustment mechanism and/or prevents vertical removal of the throat plate. In some embodiments, the throat plate includes an accessory mounting port that provides a portal for accessories, including safety accessories, to extend through the plate from beneath the table of the saw. In some embodiments, the port extends from the plate's outer perimeter to divide the plate's rear end portion into a pair of spaced-apart members. In some embodiments, these members are independently secured to the table saw and retained apart from each other by one or more of the securement mechanisms.

Woodworking machines and safety methods for use with those machines are disclosed. The machines include a detection system adapted to detect one or more dangerous conditions and a reaction system associated with the detection system. The reaction system can include an explosive to trigger the system, and also can be configured to retract a cutting tool at least partially away from a cutting region upon detection of a dangerous condition by the detection system.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A safety system prevents cutting machine operators from being accidentally carried through the infeed chute into the machine's cutting mechanism. An operator wears a safety device on his wrist and/or ankle and a sensor array mounts on opposing sides of the cutting machine's infeed chute. The sensor array elements are wound in opposite directions and connect in series opposing. The magnetic field of the safety device induces a current in the sensor array as it moves in the proximity of the sensor array. The safety system generates a signal which is proportional to the sum of the induced currents. When the signal exceeds a threshold, the safety system shuts off power to the feed mechanism and/or the cutting blades of the cutting machine, preventing injury to the operator.