A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.

A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.

In certain embodiments, a system is provided for the efficient removal of an old grip from a fishing pole while maintaining the integrity of the pole. The system can include a removal portion including one or more rotational assemblies that rotate one or more grinding members. The grinding members can include a rotational blade with a centering rod. The rotational assembly can remove the old grip while maintaining the integrity of the rod within. The system can include multiple sets of grinding members that are organized for efficient identification or may include adjustable grinding members that can be configured for specific rods. The system can further include a guide to help identify particular grinding members for use with particular fishing poles.

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

A manufacturing apparatus of a display device includes: a first stage including a plurality of cell units, each including: a display unit including a display area, and a pad area; and a protective film unit attached to the display unit, and including a display film portion corresponding to the display area, and a pad film portion corresponding to the pad area; a second stage; and a transfer unit to transfer the cell units to the second stage from the first stage, and to peel off the pad film portion. The transfer unit includes: a body member; a plurality of pins along a first direction on a first surface of the body member; a plurality of suction pads on the first surface of the body member along a second direction; and a reel member on a second surface of the body member to supply a peeling tape to the second surface.

A method for temporarily protecting a surface uses a pressure-sensitive adhesive film and reduces unwinding force when the film is unwound. The pressure-sensitive adhesive film that comprises a backing coated on one side with a rubber adhesive containing at least 5 wt % of tackifying resin, and on the other side with a silicone epoxy varnish.

A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.

The present disclosure, in some embodiments, relates to a debonding and cleaning apparatus. The apparatus has a debonding module configured to separate semiconductor substrates from carrier substrates. A first cleaning module is configured to clean surfaces of a first plurality of the semiconductor substrates and a second cleaning module is configured to clean surfaces of a second plurality of the semiconductor substrates. The apparatus also has a first substrate handling module including a first robotic arm in communication with the debonding module and a second substrate handling module including a second robotic arm that is located between the first cleaning module and the second cleaning module. The second substrate handling module is configured to transfer the first plurality of the semiconductor substrates to first cleaning module and to transfer the second plurality of the semiconductor substrates to the second cleaning module.

A method of manufacturing a delaminatable container is provided that is capable of uniformly delaminating the inner bag from the outer shell. According to the first aspect, a container body is formed having an outer shell and an inner bag. The inner bag preliminary delaminated from the outer shell in an entire circumference of a storage portion of the container body by rotating the container body while pressing the storage portion with a pressing mechanism from outside for compression or by moving the pressing mechanism along an outer circumference of the container body.